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Andras Poppe
Andras Poppe
BME Elektronikus Eszközök Tanszéke
Verified email at eet.bme.hu - Homepage
Title
Cited by
Cited by
Year
Thermal management for LED applications
CJM Lasance, A Poppe
Springer, 2014
2772014
Thermal investigation of high power optical devices by transient testing
G Farkas, QV Vader, A Poppe, G Bognár
IEEE transactions on Components and Packaging Technologies 28 (1), 45-50, 2005
1592005
Electro-thermal and logi-thermal simulation of VLSI designs
V Szekely, A Poppe, A Páhi, A Csendes, G Hajas, M Rencz
IEEE Transactions on Very Large Scale Integration (VLSI) Systems 5 (3), 258-269, 1997
1161997
Thermal measurement and modeling of multi-die packages
A Poppe, Y Zhang, J Wilson, G Farkas, P Szabó, J Parry, M Rencz, ...
IEEE Transactions on components and packaging technologies 32 (2), 484-492, 2009
1022009
Multi-domain compact modeling of LEDs: An overview of models and experimental data
A Poppe
Microelectronics Journal 46 (12), 1138-1151, 2015
922015
On the standardization of thermal characterization of LEDs
A Poppe, CJM Lasance
2009 25th Annual IEEE Semiconductor Thermal Measurement and Management …, 2009
852009
Multi-domain simulation and measurement of power LED-s and power LED assemblies
A Poppe, G Farkas, V Székely, G Horváth, M Rencz
Twenty-second annual IEEE semiconductor thermal measurement and management …, 2006
842006
Simulation of LED based luminaires by using multi-domain compact models of LEDs and compact thermal models of their thermal environment
A Poppe
Microelectronics Reliability 72, 65-74, 2017
742017
Electric and thermal transient effects in high power optical devices
G Farkas, S Haque, F Wall, PS Martin, A Poppe, Q van Voorst Vader, ...
Twentieth Annual IEEE Semiconductor Thermal Measurement and Management …, 2004
742004
Increasing the accuracy of structure function based thermal material parameter measurements
M Rencz, A Poppe, E Kollár, S Ress, V Székely
IEEE Transactions on components and packaging technologies 28 (1), 51-57, 2005
732005
Electro-thermal simulation: a realization by simultaneous iteration
V Székely, A Poppe, M Rencz, A Csendes, A Páhi
Microelectronics journal 28 (3), 247-262, 1997
71*1997
THERMAN: a thermal simulation tool for IC chips, microstructures and PW boards
V Székely, A Poppe, M Rencz, M Rosental, T Teszéri
Microelectronics Reliability 40 (3), 517-524, 2000
662000
Multi-domain modelling of LEDs for supporting virtual prototyping of luminaires
A Poppe, G Farkas, L Gaál, G Hantos, J Hegedüs, M Rencz
Energies 12 (10), 1909, 2019
542019
Luminaire digital design flow with multi-domain digital twins of LEDs
G Martin, C Marty, R Bornoff, A Poppe, G Onushkin, M Rencz, J Yu
Energies 12 (12), 2389, 2019
462019
Dynamic temperature measurements: tools providing a look into package and mount structures
A Poppe, V Székely
Electronics Cooling 8, 10-19, 2002
432002
Temperature dependent thermal resistance in power LED assemblies and a way to cope with it
A Poppe, G Molnár, T Temesvölgyi
Semiconductor Thermal Measurement and Management Symposium, 2010. SEMI-THERM …, 2010
422010
New approaches in the transient thermal measurements
V Székely, S Ress, A Poppe, S Török, D Magyari, Z Benedek, K Torki, ...
Microelectronics Journal 31 (9-10), 727-733, 2000
412000
High-aspect-ratio metal microchannel plates for microelectronic cooling applications
W Yu, MPY Desmulliez, A Drufke, M Leonard, RS Dhariwal, D Flynn, ...
Journal of Micromechanics and Microengineering 20 (2), 025004, 2009
402009
Nonlinear electro-thermal modeling and field-simulation of OLEDs for lighting applications I: Algorithmic fundamentals
L Pohl, E Kollár, A Poppe, Z Kohári
Microelectronics Journal 43 (9), 624-632, 2012
362012
Electrical, thermal and optical characterization of power LED assemblies
A Poppe, G Farkas, G Horváth
arXiv preprint arXiv:0709.1815, 2007
342007
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