| Enhanced thermal conductivity in Cu/diamond composites by tailoring the thickness of interfacial TiC layer L Wang, J Li, M Catalano, G Bai, N Li, J Dai, X Wang, H Zhang, J Wang, ... Composites Part A: Applied Science and Manufacturing 113, 76-82, 2018 | 104 | 2018 |
| High thermal conductivity of Cu-B/diamond composites prepared by gas pressure infiltration G Bai, N Li, X Wang, J Wang, MJ Kim, H Zhang Journal of Alloys and Compounds 735, 1648-1653, 2018 | 100 | 2018 |
| Tailoring interface structure and enhancing thermal conductivity of Cu/diamond composites by alloying boron to the Cu matrix G Bai, L Wang, Y Zhang, X Wang, J Wang, MJ Kim, H Zhang Materials Characterization 152, 265-275, 2019 | 92 | 2019 |
| Interfacial structure evolution and thermal conductivity of Cu-Zr/diamond composites prepared by gas pressure infiltration L Wang, J Li, G Bai, N Li, X Wang, H Zhang, J Wang, MJ Kim Journal of Alloys and Compounds 781, 800-809, 2019 | 72 | 2019 |
| Precise control of versatile microstructure and properties of graphene aerogel via freezing manipulation X Zhu, C Yang, P Wu, Z Ma, Y Shang, G Bai, X Liu, G Chang, N Li, J Dai, ... Nanoscale 12 (8), 4882-4894, 2020 | 64 | 2020 |
| Effects of the addition of lanthanum and ultrasonic stirring on the microstructure and mechanical properties of the in situ Mg2Si/Al composites G Bai, Z Liu, J Lin, Z Yu, Y Hu, C Wen Materials & Design 90, 424-432, 2016 | 43 | 2016 |
| Reinforcement size effect on thermal conductivity in Cu-B/diamond composite Y Zhang, G Bai, X Liu, J Dai, X Wang, H Zhang Journal of Materials Science & Technology 91, 1-4, 2021 | 35 | 2021 |
| Unveiling interfacial structure and improving thermal conductivity of Cu/diamond composites reinforced with Zr-coated diamond particles L Wang, G Bai, N Li, L Gao, J Li, K Xu, X Wang, H Zhang, J Wang, MJ Kim Vacuum 202, 111133, 2022 | 30 | 2022 |
| Tunable coefficient of thermal expansion of Cu-B/diamond composites prepared by gas pressure infiltration G Bai, Y Zhang, J Dai, L Wang, X Wang, J Wang, MJ Kim, X Chen, ... Journal of Alloys and Compounds 794, 473-481, 2019 | 30 | 2019 |
| Effect of ultrasonic stirring on the microstructure and mechanical properties of in situ Mg2Si/Al composite J Lin, G Bai, Z Liu, L Niu, G Li, C Wen Materials Chemistry and Physics 178, 112-118, 2016 | 25 | 2016 |
| Manipulating in-situ discrete carbide interlayer to achieve high thermal conductivity in Cu-B/diamond composite Y Zhang, G Bai, X Zhu, J Dai, X Wang, J Wang, MJ Kim, H Zhang Materials Today Communications 34, 105357, 2023 | 24 | 2023 |
| High-temperature thermal conductivity and thermal cycling behavior of Cu–B/diamond composites GZ Bai, YJ Zhang, XY Liu, JJ Dai, XT Wang, HL Zhang IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2019 | 21 | 2019 |
| Microstructure and thermal conductivity of AlN coating on Cu substrate deposited by arc ion plating Y Zhang, J Dai, G Bai, H Zhang Materials Chemistry and Physics 241, 122374, 2020 | 18 | 2020 |
| Effect of chromium interlayer thickness on interfacial thermal conductance across copper/diamond interface X Liu, F Sun, W Wang, J Zhao, L Wang, Z Che, G Bai, X Wang, J Wang, ... International Journal of Minerals, Metallurgy and Materials 29 (11), 2020-2031, 2022 | 10 | 2022 |
| Mechanical properties of Cu-B/diamond composites prepared by gas pressure infiltration G Bai, Y Zhang, J Dai, X Wang, H Zhang Journal of Materials Engineering and Performance 29, 3107-3119, 2020 | 10 | 2020 |
| Microstructure Evolution and Performance Enhancement of Sintered Aluminum Foils for Aluminum Electrolytic Capacitors G Bai, Z Chen, J Liu, F Wang, Y Zhang Journal of Electronic Materials 53 (4), 2026-2039, 2024 | 3 | 2024 |
| Synergistic regulation and optimization of microstructure, coercivity, and thermal stability in sintered NdFeB magnets through grain boundary diffusion of Dy and Al elements R Chang, G Bai, Y Li, Z Yan, X Qin, J Guo, F Wang, X Xu Journal of Materials Research and Technology 34, 2183-2192, 2025 | 1 | 2025 |
| A numerical study of the effect of interfacial thermal resistance on thermal conductivity of Cu-B/diamond composites G Bai, J Li, Y Zhang, C Wang, X Wang, H Zhang Vacuum 230, 113654, 2024 | 1 | 2024 |
| Investigation of the matrix and interface of Cu–B/diamond composite by atom probe tomography G Bai, Y Zhang, W Shi, X Wang, H Zhu, F Wang, H Zhang Ceramics International 50 (8), 12915-12923, 2024 | 1 | 2024 |
| Research of Preparing Parameters in the Complex Process on Microstructure in Semisolid A356 Alloy Slurry with Micro-Addition of La Z Liu, LN Xu, JY Zhang, GZ Bai, XM Liu Materials Science Forum 877, 114-120, 2017 | 1 | 2017 |