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Eric PopPease-Ye Professor of Electrical Engineering, MSE, AP at Stanford & SLACVerified email at stanford.edu
ZHANG Yong-WeiInstitute of High Performance Computing, Agency for Science, Technology and Research.Verified email at ihpc.a-star.edu.sg
gang zhangInstitute of High Performance Computing, A*STAR, SingaporeVerified email at ihpc.a-star.edu.sg
Massimo V FischettiThe University of Texas at DallasVerified email at utdallas.edu
Zhihao Yu南京大学Verified email at nju.edu.cn
Xinran WangProfessor, Nanjing UniversityVerified email at nju.edu.cn
Yiming Pan (潘义明)Assistant Professor, ShanghaiTech UniversityVerified email at shanghaitech.edu.cn
Myung-Ho BaeKorea Research Institute of Standards and Science, [email protected]Verified email at kriss.re.kr
David EstradaBoise State University; Idaho National LaboratoryVerified email at boisestate.edu
Yongqing CaiUniversity of Macau, China; IHPCVerified email at um.edu.mo
Feng XiongAssociate Professor, Department of Electrical and Computer Engineering, University of PittsburghVerified email at pitt.edu
Litao SunProfessor, Southeast UniversityVerified email at seu.edu.cn
Tao Xu(徐涛)Southeast UniversityVerified email at seu.edu.cn
Cheng-Wei QIUProvost's Chair Professor, National University of SingaporeVerified email at nus.edu.sg
JTL ThongProfessor, Singapore Institute of TechnologyVerified email at SingaporeTech.edu.sg
Shela AboudSr. Research Scientist, Stanford UniversityVerified email at stanford.edu
Jinlan WangChief Professor of Physics, Southeast University, ChinaVerified email at seu.edu.cn
Albert LiaoEmerging Memory Engineer, MicronVerified email at micron.com
CHI DongzhiPrincipal Scientist, Institute of Materials Research and EngineeringVerified email at imre.a-star.edu.sg
Joshua D. WoodPrincipal Solutions Engineer, DynatraceVerified email at dynatrace.com