Get my own profile
Public access
View all22 articles
6 articles
available
not available
Based on funding mandates
Co-authors
Daniele IelminiProfessor of ElectronicsVerified email at elet.polimi.it
Giacomo PedrettiResearch Scientist, Hewlett Packard LaboratoriesVerified email at hpe.com
Alessandro BricalliPolitecnico di MilanoVerified email at polimi.it
Elia AmbrosiTSMCVerified email at tsmc.com
Wei WangScientist, Peng Cheng LaboratoryVerified email at pcl.ac.cn
Piergiulio MannocciResearcher, Politecnico di MilanoVerified email at polimi.it
Ming WangAssociate Professor, Fudan UniversityVerified email at fudan.edu.cn
Xiaodong Chen(陈晓东)President's Chair Professor in Materials Science and Engineering, Nanyang Technological UniversityVerified email at ntu.edu.sg
Mario LaudatoWestern DigitalVerified email at wdc.com
Yugui YaoBeijing Institute of TechnologyVerified email at bit.edu.cn
Zhongrui WangSouthern University of Science and TechnologyVerified email at sustech.edu.cn
Linfeng SUNProfessor, Beijing Institute of TechnologyVerified email at bit.edu.cn
Peng LinZhejiang UniversityVerified email at zju.edu.cn
Xumeng ZhangFrontier Institute of Chip and System, Fudan UniversityVerified email at fudan.edu.cn
Wanxiang Feng(冯万祥)Professor, Beijing Institute of TechnologyVerified email at bit.edu.cn
Shaocong WangUniversity of Notre DameVerified email at nd.edu
Aitian ChenUniversity of Electronic Science and Technology of ChinaVerified email at kaust.edu.sa
Wenhui DuanTsinghua University, Beijing, ChinaVerified email at tsinghua.edu.cn
Jin KuijuanInstitute of Physics, Chinese Academy of SciencesVerified email at iphy.ac.cn
Nicola LepriSenior Analog Design Engineer, Innatera Nanosystems B.V.Verified email at innatera.com