Mun Goung Jeong

20192020202120222023202420252 16 9 21 17 15 5

Bong Jae LeeProfessor, Department of Mechanical Engineering, KAISTVerified email at kaist.ac.kr
Joong Bae KimAssistant Professor, Department of Mechanical & Automotive Engineering, Kongju National UniversityVerified email at kongju.ac.kr
Caiyan QinAssociate Professor, Harbin Institute of Technology (Shenzhen)Verified email at hit.edu.cn
Mingyu LeeDepartment of Mechanical Engineering, KAISTVerified email at kaist.ac.kr
Jungchul LeeMechanical Engineering, Korea Advanced Institute of Science and TechnologyVerified email at kaist.ac.kr

Mun Goung Jeong

Center for Scientific Instrumentation, Korea Basic Science Institute

Verified email at kbsi.re.kr


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Heat transfer analysis of a high-power and large-capacity thermal battery and investigation of effective thermal model MG Jeong, JH Cho, BJ Lee Journal of Power Sources 424, 35-41, 2019	48	2019
Synthesis of therminol‐graphite nanofluids and photo‐thermal conversion properties MG Jeong, JB Kim, C Qin, J Lee, BJ Lee International Journal of Energy Research 45 (7), 11320-11328, 2021	13	2021
Formation, evolution, and prevention of thermally induced defects on germanium and silicon upon high-temperature vacuum annealing T Kim, MG Jeong, BJ Lee, J Lee Journal of Vacuum Science & Technology A 39 (6), 2021	8	2021
Thick germanium-on-nothing structures by annealing microscale hole arrays with straight sidewall profiles MG Jeong, T Kim, BJ Lee, J Lee Journal of Microelectromechanical Systems 31 (2), 183-185, 2022	7	2022
Subsurface Imaging of Microfabricated Silicon Membrane–Cavity Structures Using Near‐Infrared Interferometry MG Jeong, T Kim, BJ Lee, J Lee Advanced Engineering Materials 24 (10), 2200531, 2022	4	2022
Synthesis of low viscous dielectric nanofluids and characterization of convection heat transfer JB Kim, MG Jeong, BJ Lee Journal of Thermophysics and Heat Transfer 32 (4), 965-974, 2018	4	2018
Surrogate model for optimizing annealing duration of self-assembled membrane-cavity structures MG Jeong, T Kim, BJ Lee, J Lee Micro and Nano Systems Letters 10 (1), 6, 2022	1	2022

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