Design of a piezoelectric-actuated microgripper with a three-stage flexure-based amplification F Wang, C Liang, Y Tian, X Zhao, D Zhang IEEE/ASME Transactions on Mechatronics 20 (5), 2205-2213, 2014 | 176 | 2014 |
Design and control of a compliant microgripper with a large amplification ratio for high-speed micro manipulation F Wang, C Liang, Y Tian, X Zhao, D Zhang IEEE/ASME Transactions on Mechatronics 21 (3), 1262-1271, 2016 | 174 | 2016 |
Design and control of a novel asymmetrical piezoelectric actuated microgripper for micromanipulation C Liang, F Wang, B Shi, Z Huo, K Zhou, Y Tian, D Zhang Sensors and Actuators A: Physical 269, 227-237, 2018 | 128 | 2018 |
A novel actuator-internal micro/nano positioning stage with an arch-shape bridge-type amplifier F Wang, Z Huo, C Liang, B Shi, Y Tian, X Zhao, D Zhang IEEE Transactions on Industrial Electronics 66 (12), 9161-9172, 2018 | 122 | 2018 |
Online study of cracks during laser cladding process based on acoustic emission technique and finite element analysis F Wang, H Mao, D Zhang, X Zhao, Y Shen Applied surface science 255 (5), 3267-3275, 2008 | 117 | 2008 |
Development of a piezo-driven 3-DOF stage with T-shape flexible hinge mechanism K Cai, Y Tian, F Wang, D Zhang, B Shirinzadeh Robotics and Computer-Integrated Manufacturing 37, 125-138, 2016 | 108 | 2016 |
Design and control methodology of a 3-DOF flexure-based mechanism for micro/nano-positioning Z Guo, Y Tian, C Liu, F Wang, X Liu, B Shirinzadeh, D Zhang Robotics and Computer-Integrated Manufacturing 32, 93-105, 2015 | 100 | 2015 |
A two-finger soft-robotic gripper with enveloping and pinching grasping modes S Liu, F Wang, Z Liu, W Zhang, Y Tian, D Zhang IEEE/ASME Transactions on Mechatronics 26 (1), 146-155, 2020 | 95 | 2020 |
Modeling and controller design of a 6-DOF precision positioning system K Cai, Y Tian, X Liu, S Fatikow, F Wang, L Cui, D Zhang, B Shirinzadeh Mechanical Systems and Signal Processing 104, 536-555, 2018 | 90 | 2018 |
Design and control of a 6-degree-of-freedom precision positioning system K Cai, Y Tian, F Wang, D Zhang, X Liu, B Shirinzadeh Robotics and Computer-Integrated Manufacturing 44, 77-96, 2017 | 82 | 2017 |
A novel voice coil motor-driven compliant micropositioning stage based on flexure mechanism J Shang, Y Tian, Z Li, F Wang, K Cai Review of Scientific Instruments 86 (9), 2015 | 82 | 2015 |
A spatial deployable three-DOF compliant nano-positioner with a three-stage motion amplification mechanism Y Tian, K Lu, F Wang, C Zhou, Y Ma, X Jing, C Yang, D Zhang IEEE/ASME Transactions on Mechatronics 25 (3), 1322-1334, 2020 | 78 | 2020 |
A novel XYZ micro/nano positioner with an amplifier based on L-shape levers and half-bridge structure Y Tian, Y Ma, F Wang, K Lu, D Zhang Sensors and Actuators A: Physical 302, 111777, 2020 | 77 | 2020 |
Design of a novel dual-axis micromanipulator with an asymmetric compliant structure F Wang, B Shi, Y Tian, Z Huo, X Zhao, D Zhang IEEE/ASME transactions on mechatronics 24 (2), 656-665, 2019 | 75 | 2019 |
A 2-DOF monolithic compliant rotation platform driven by piezoelectric actuators C Liang, F Wang, Z Huo, B Shi, Y Tian, X Zhao, D Zhang IEEE Transactions on Industrial Electronics 67 (8), 6963-6974, 2019 | 73 | 2019 |
A new automatic resonance frequency tracking method for piezoelectric ultrasonic transducers used in thermosonic wire bonding H Zhang, F Wang, D Zhang, Y Hou, T Xi Sensors and Actuators A: Physical 235, 140-150, 2015 | 73 | 2015 |
Modeling and analysis of soft pneumatic network bending actuators Z Liu, F Wang, S Liu, Y Tian, D Zhang IEEE/ASME Transactions on Mechatronics 26 (4), 2195-2203, 2020 | 72 | 2020 |
An improved adaptive genetic algorithm for image segmentation and vision alignment used in microelectronic bonding F Wang, J Li, S Liu, X Zhao, D Zhang, Y Tian IEEE/ASME Transactions On Mechatronics 19 (3), 916-923, 2013 | 68 | 2013 |
A 2-DOF nano-positioning scanner with novel compound decoupling-guiding mechanism F Wang, X Zhao, Z Huo, B Shi, C Liang, Y Tian, D Zhang Mechanism and Machine Theory 155, 104066, 2021 | 67 | 2021 |
Development of novel ultrasonic transducers for microelectronics packaging F Wang, X Zhao, D Zhang, Y Wu Journal of materials processing technology 209 (3), 1291-1301, 2009 | 67 | 2009 |