Origami tunable frequency selective surfaces K Fuchi, J Tang, B Crowgey, AR Diaz, EJ Rothwell, RO Ouedraogo IEEE antennas and wireless propagation letters 11, 473-475, 2012 | 122 | 2012 |
An origami tunable metamaterial K Fuchi, AR Diaz, EJ Rothwell, RO Ouedraogo, J Tang Journal of Applied Physics 111 (8), 084905, 2012 | 81 | 2012 |
Dynamic beam shaping using a dual-band electronically tunable reflectarray antenna A Tayebi, J Tang, PR Paladhi, L Udpa, SS Udpa, EJ Rothwell IEEE Transactions on Antennas and Propagation 63 (10), 4534-4539, 2015 | 60 | 2015 |
A tunable dual-band miniaturized monopole antenna for compact wireless devices RO Ouedraogo, J Tang, K Fuchi, EJ Rothwell, AR Diaz, P Chahal IEEE Antennas and Wireless Propagation Letters 13, 1247-1250, 2014 | 25 | 2014 |
Characterization of biaxial anisotropic material using a reduced aperture waveguide BR Crowgey, O Tuncer, J Tang, EJ Rothwell, B Shanker, LC Kempel, ... IEEE Transactions on Instrumentation and Measurement 62 (10), 2739-2750, 2013 | 24 | 2013 |
A continuously tunable miniaturized patch antenna J Tang, RO Ouedraogo, EJ Rothwell, AR Diaz, K Fuchi IEEE Antennas and Wireless Propagation Letters 13, 1080-1083, 2014 | 20 | 2014 |
Bayesian active learning for uncertainty quantification of high speed channel signaling HM Torun, JA Hejase, J Tang, WD Beckert, M Swaminathan 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging …, 2018 | 19 | 2018 |
Design and development of an electrically-controlled beam steering mirror for microwave tomography A Tayebi, J Tang, PR Paladhi, L Udpa, S Udpa AIP Conference Proceedings 1650 (1), 501-508, 2015 | 10 | 2015 |
Package and printed circuit board design of a 19.2 Gb/s data link for high-performance computing S Chun, J Hejase, J Tang, J Audet, D Becker, D Dreps, G Wiedemeier, ... 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1701-1707, 2017 | 9 | 2017 |
Waveguide band‐stop filter design using optimized pixelated inserts RO Ouedraogo, EJ Rothwell, AR Diaz, K Fuchi, J Tang Microwave and optical technology letters 55 (1), 141-143, 2013 | 9 | 2013 |
Neural Network Based Prediction of PCB Glass Weave Induced Skew DJ Boday, Z Chen, JA Hejase, RS Krabbenhoft, PR Paladhi, T Junyan US Patent App. 15/299,546, 2018 | 8 | 2018 |
A Waveguide Verification Standard Design Procedure for the Microwave Characterization of Magnetic Materials B Crowgey, J Tang, E Rothwell, B Shanker, L Kempel Progress In Electromagnetics Research 150, 29-40, 2014 | 8 | 2014 |
A dual-band tunable reflectarray J Tang, A Tayebi, S Udpa, EJ Rothwell, A Temme 2014 IEEE Antennas and Propagation Society International Symposium (APSURSI …, 2014 | 8 | 2014 |
Rx equalization for a high-speed channel based on Bayesian active learning using dropout X Yang, J Tang, HM Torun, WD Becker, JA Hejase, M Swaminathan 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging …, 2020 | 6 | 2020 |
OpenCAPI Memory Interface Signal Integrity Study for High-Speed DDR5 Differential DIMM Channel with Standard Loss FR-4 Material and SNIA SFF-TA-1002 Connector B Cai, J Hejase, K Giesen, J Tang, B Connolly, KH Kim, D Dreps, Z Fan, ... 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1200-1207, 2019 | 6 | 2019 |
A Comprehensive Signal Integrity Study of Differential Pairs Routed within a PCB Via Field J Tang, JA Hejase, P RoyPaladhi, WD Beckir, DM Dreps 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging …, 2018 | 6 | 2018 |
A dielectric based waveguide integrated in a multilayer PCB for ultra high speed communications J Tang, JA Hejase, JC Myers, SR Connor, DM Dreps, J Kuczynski 2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging …, 2016 | 6 | 2016 |
A Neural Network Based Method for Predicting PCB Glass Weave Induced Skew JA Hejase, PR Paladhi, RS Krabbenhoft, Z Chen, J Tang, DJ Boday Electrical Performance Of Electronic Packaging And Systems (EPEPS), 2016 …, 2016 | 5 | 2016 |
A Neural Network Based Method for Predicting PCB Glass Weave Induced Skew DB J. Hejase, P. Paladhi, R. Krabbenhoft, Z. Chen, J. Tang Electrical Performance Of Electronic Packaging And Systems (EPEPS), 2016 …, 2016 | 5* | 2016 |
Far end crosstalk mitigation of differential high speed interconnects within printed circuit board via fields J Tang, X Yang, JA Hejase, M Bohra, Y Zhang, X Duan, D Kaller, ... 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging …, 2021 | 4 | 2021 |