| Single-phase thermal and hydraulic performance of embedded silicon micro-pin fin heat sinks using R245fa D Kong, KW Jung, S Jung, D Jung, J Schaadt, M Iyengar, C Malone, ... International Journal of Heat and Mass Transfer 141, 145-155, 2019 | 50 | 2019 |
| A holistic approach to thermal-hydraulic design of 3D manifold microchannel heat sinks for energy-efficient cooling D Kong, Y Kim, M Kang, E Song, Y Hong, HS Kim, KJ Rah, HG Choi, ... Case Studies in Thermal Engineering 28, 101583, 2021 | 48 | 2021 |
| Hierarchically structured laser-induced graphene for enhanced boiling on flexible substrates D Kong, M Kang, KY Kim, J Jang, J Cho, JB In, H Lee ACS applied materials & interfaces 12 (33), 37784-37792, 2020 | 42 | 2020 |
| An additively manufactured manifold-microchannel heat sink for high-heat flux cooling D Kong, E Jung, Y Kim, VV Manepalli, KJ Rah, HS Kim, Y Hong, HG Choi, ... International Journal of Mechanical Sciences 248, 108228, 2023 | 38 | 2023 |
| Thermal design and management of micro-pin fin heat sinks for energy-efficient three-dimensional stacked integrated circuits D Jung, H Lee, D Kong, E Cho, KW Jung, CR Kharangate, M Iyengar, ... International Journal of Heat and Mass Transfer 175, 121192, 2021 | 38 | 2021 |
| Enhanced heat transfer using microporous copper inverse opals H Lee, T Maitra, J Palko, D Kong, C Zhang, MT Barako, Y Won, M Asheghi, ... Journal of Electronic Packaging 140 (2), 020906, 2018 | 28 | 2018 |
| Experimental investigation of embedded micropin-fins for single-phase heat transfer and pressure drop CR Kharangate, K Wook Jung, S Jung, D Kong, J Schaadt, M Iyengar, ... Journal of Electronic Packaging 140 (2), 021001, 2018 | 23 | 2018 |
| Analysis of the enhancing mechanism in pool boiling heat transfer through wetting speed for rough aluminum surfaces with FC-72 J Kim, J Yeom, D Kong, H Lee, S Kim International Journal of Heat and Mass Transfer 150, 119325, 2020 | 20 | 2020 |
| Boiling-induced thermal degradation of copper inverse opals and its mitigation D Kong, K Kim, E Jung, K Jiang, Q Wu, B Jang, HJ Kwon, M Asheghi, ... International Communications in Heat and Mass Transfer 151, 107250, 2024 | 11 | 2024 |
| Thermal performance analysis of heat pipe heat exchanger for effective waste heat recovery G Geum, S Kang, S Cho, D Kong, S Lee, JH Seo, DH Shin, SH Lee, J Lee, ... International Communications in Heat and Mass Transfer 151, 107223, 2024 | 9 | 2024 |
| Experimental and computational investigation of thermal performance and fluid flow in two-phase closed thermosyphon S Cho, D Kong, G Geum, S Kang, JH Seo, JS Kim, SH Lee, J Lee, H Lee Applied Thermal Engineering 235, 121327, 2023 | 9 | 2023 |
| Dynamic artificial neural network model for ultralow temperature prediction in hydrogen storage tank H Lee, K Kim, D Kong, MH Ahn, D Lee, H Jun, CR Kharangate, J Ryu, ... Journal of energy storage 69, 107866, 2023 | 8 | 2023 |
| Capillary-enhanced two-phase micro-cooler using copper-inverse-opal wick with silicon microchannel manifold for high-heat-flux cooling application H Kwon, Q Wu, D Kong, S Hazra, K Jiang, S Narumanchi, H Lee, ... International Communications in Heat and Mass Transfer 156, 107592, 2024 | 7 | 2024 |
| Multimodal machine learning for predicting heat transfer characteristics in micro-pin fin heat sinks H Lee, G Lee, K Kim, D Kong, H Lee Case Studies in Thermal Engineering 57, 104331, 2024 | 7 | 2024 |
| Enhanced boiling heat transfer via microporous copper surface integration in a manifold microgap K Kim, D Kong, Y Kim, B Jang, J Cho, HJ Kwon, H Lee Applied Thermal Engineering 241, 122325, 2024 | 7 | 2024 |
| Extreme heat flux cooling from functional copper inverse opal-coated manifold microchannels D Kong, H Kwon, B Jang, HJ Kwon, M Asheghi, KE Goodson, H Lee Energy Conversion and Management 315, 118809, 2024 | 6 | 2024 |
| Enhanced immersion cooling using laser-induced graphene for Li-ion battery thermal management EB Jung, D Kong, M Kang, J Park, JH Kim, J Jeong, JB In, KY Oh, H Lee International Communications in Heat and Mass Transfer 155, 107558, 2024 | 4 | 2024 |
| Enhanced heat transfer in a microchannel with pseudo-roughness induced by Onsager-Wien effect RD Selvakumar, D Kong, HK Lee, CR Kharangate, J Ryu, H Lee Applied Thermal Engineering 233, 121122, 2023 | 4 | 2023 |
| Cooling apparatus for power module SH Lee, SH Kwon, SM Lee, JH Lee, HJ Park, YS Kim, GH Lee, DY Kong, ... US Patent 12,150,273, 2024 | 2 | 2024 |
| Explicitly defined empirical constant for phase-change simulation in a two-phase closed thermosyphon S Cho, D Kong, G Geum, S Lee, J Park, SH Lee, J Lee, H Lee International Communications in Heat and Mass Transfer 158, 107932, 2024 | 1 | 2024 |
Hyoungsoon LeeChung-Ang UniversityVerified email at cau.ac.kr