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Co-authors
- kiet tieuVerified email at uow.edu.au
- Kun ZhouNanyang Technological UniversityVerified email at ntu.edu.sg
- Dr.Xu WenJilin UniversityVerified email at m.titech.ac.jp
- Toshihiko KosekiVerified email at material.t.u-tokyo.ac.jp
- Pengfei WangUniversity of Science and Technology of ChinaVerified email at ustc.edu.cn
- Charlie KongSenior Research Officer, University of New South WalesVerified email at unsw.edu.au
- Yasushi ShibutaProfessor of Materials Engineering, The University of TokyoVerified email at material.t.u-tokyo.ac.jp
- Jhe-Yu LinNational Taipei University of TechnologyVerified email at mail.ntut.edu.tw
- Shoichi NambuAssociate Professor, The University of TokyoVerified email at metall.t.u-tokyo.ac.jp
- Donghwan KimProfessor of Sunkyunkwan UniversityVerified email at skku.edu
- Jun HuangAnhui University of TechnologyVerified email at mist.i.u-tokyo.ac.jp
- Kun Qian 钱昆 (Prof. Dr.-Ing., SMIEEE)Professor, Beijing Institute of TechnologyVerified email at bit.edu.cn
- Liang Zhang 張亮Chongqing UniversityVerified email at uowmail.edu.au
- Guoxing LuUniversity Distinguished Professor, Swinburne University of TechnologyVerified email at swin.edu.au
- Se-Eun ShinSunchon National UniversityVerified email at scnu.ac.kr
- Hung-Wei (Homer) Yen (顏鴻威)Department of Materials Science and Engineering, National Taiwan UniversityVerified email at ntu.edu.tw
- Chee Kai ChuaSingapore University of Technology and DesignVerified email at sutd.edu.sg
- Jiaming BaiSouthern University of Science and TechnologyVerified email at sustech.edu.cn
- Jun WeiHITSZVerified email at hit.edu.cn
- Zhong YOUUniversity of Oxford