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Paul EvansProfessor, Materials Science and Engineering, University of Wisconsin-MadisonVerified email at wisc.edu
Youngjun AhnMaterials Scientist, Materials Science Division, Argonne National LaboratoryVerified email at anl.gov
Rui LiuArgonne National LaboratoryVerified email at anl.gov
DONALD SAVAGEUniversity of WisconsinVerified email at wisc.edu
Hyeon Jun LeeKangwon National UniversityVerified email at kangwon.ac.kr
Eric LandahlPhysics Professor, DePaul UniversityVerified email at depaul.edu
Susan E. BabcockUniversity of WisconsinVerified email at wisc.edu
Haidan WenArgonne National LabVerified email at anl.gov
Sanjith UnithrattilGwangju Institute of Science and TechnologyVerified email at gist.ac.kr
Peng ZuoStaff Scientist, Purdue University/Past: ASU, PNNL, UW-Madison, Institute NEEL(CNRS&UGA)Verified email at purdue.edu
Sae Hwan ChunPAL-XFEL, Pohang Accelerator LaboratoryVerified email at postech.ac.kr
Jun Young LeeSamsung ElectronicsVerified email at samsung.com
Tae Yeon KimPostdoctoral researcher, University of California, BerkeleyVerified email at berkeley.edu
Deepankar sri gyanGraduate StudentVerified email at wisc.edu
Carolina AdamoNorthrop GrummanVerified email at stanford.edu
Darrell G. SchlomCornell UniversityVerified email at cornell.edu
Karina Riascos-RodriguezLawrence Berkeley National LabVerified email at lbl.gov
Jia-Mian HuAssociate Professor, University of Wisconsin–MadisonVerified email at wisc.edu
John BooskeProf. Elec. & Comp. Engr., Univ. of Wisconsin-Madison, Fellow (IEEE, APS, IOP, AAAS)Verified email at wisc.edu
Ryan JacobsResearch Scientist, University of Wisconsin-MadisonVerified email at wisc.edu