| High-dimensional global optimization method for high-frequency electronic design HM Torun, M Swaminathan IEEE Transactions on Microwave Theory and Techniques 67 (6), 2128-2142, 2019 | 130 | 2019 |
| A global Bayesian optimization algorithm and its application to integrated system design HM Torun, M Swaminathan, AK Davis, MLF Bellaredj IEEE Transactions on Very Large Scale Integration (VLSI) Systems 26 (4), 792-802, 2018 | 125 | 2018 |
| Machine learning and uncertainty quantification for surrogate models of integrated devices with a large number of parameters R Trinchero, M Larbi, HM Torun, FG Canavero, M Swaminathan IEEE Access 7, 4056-4066, 2018 | 106 | 2018 |
| Architecture, chip, and package codesign flow for interposer-based 2.5-D chiplet integration enabling heterogeneous IP reuse J Kim, G Murali, H Park, E Qin, H Kwon, VCK Chekuri, NM Rahman, ... IEEE Transactions on Very Large Scale Integration (VLSI) Systems 28 (11 …, 2020 | 83 | 2020 |
| RFID backscattering in long-range scenarios F Amato, HM Torun, GD Durgin IEEE Transactions on Wireless Communications 17 (4), 2718-2725, 2018 | 77 | 2018 |
| Demystifying machine learning for signal and power integrity problems in packaging M Swaminathan, HM Torun, H Yu, JA Hejase, WD Becker IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 71 | 2020 |
| Architecture, chip, and package co-design flow for 2.5 D IC design enabling heterogeneous IP reuse J Kim, G Murali, H Park, E Qin, H Kwon, V Chaitanya, K Chekuri, N Dasari, ... Proceedings of the 56th Annual Design Automation Conference 2019, 1-6, 2019 | 63 | 2019 |
| Causal and passive parameterization of S-parameters using neural networks HM Torun, AC Durgun, K Aygün, M Swaminathan IEEE Transactions on Microwave Theory and Techniques 68 (10), 4290-4304, 2020 | 44 | 2020 |
| A spectral convolutional net for co-optimization of integrated voltage regulators and embedded inductors HM Torun, H Yu, N Dasari, VCK Chekuri, A Singh, J Kim, SK Lim, ... 2019 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 1-8, 2019 | 29 | 2019 |
| Chiplet/interposer co-design for power delivery network optimization in heterogeneous 2.5-D ICs J Kim, VCK Chekuri, NM Rahman, MA Dolatsara, HM Torun, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 28 | 2021 |
| Heterogeneous integration for artificial intelligence: Challenges and opportunities S Mukhopadhyay, Y Long, B Mudassar, CS Nair, BH DeProspo, ... IBM Journal of Research and Development 63 (6), 4: 1-4: 1, 2019 | 28 | 2019 |
| Silicon vs. Organic interposer: PPA and reliability tradeoffs in heterogeneous 2.5 D chiplet integration J Kim, VCK Chekuri, NM Rahman, MA Dolatsara, H Torun, ... 2020 IEEE 38th International Conference on Computer Design (ICCD), 80-87, 2020 | 23 | 2020 |
| Bayesian active learning for uncertainty quantification of high speed channel signaling HM Torun, JA Hejase, J Tang, WD Beckert, M Swaminathan 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging …, 2018 | 19 | 2018 |
| A Bayesian framework for optimizing interconnects in high-speed channels HM Torun, M Larbi, M Swaminathan 2018 IEEE MTT-S International Conference on Numerical Electromagnetic and …, 2018 | 19 | 2018 |
| Beyond the limits of classic backscattering communications: A quantum tunneling RFID tag F Amato, HM Torun, GD Durgin 2017 IEEE International Conference on RFID (RFID), 20-25, 2017 | 19 | 2017 |
| Design of SIW filters in D-band using invertible neural nets H Yu, HM Torun, MU Rehman, M Swaminathan 2020 IEEE/MTT-S International Microwave Symposium (IMS), 72-75, 2020 | 17 | 2020 |
| Multicomponent mechanical characterization of atherosclerotic human coronary arteries: an experimental and computational hybrid approach S Guvenir Torun, HM Torun, HHG Hansen, G Gandini, I Berselli, ... Frontiers in Physiology 12, 733009, 2021 | 15 | 2021 |
| Inverse design of transmission lines with deep learning K Roy, MA Dolatsara, HM Torun, R Trinchero, M Swaminathan 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging …, 2019 | 15 | 2019 |
| Machine learning driven advanced packaging and miniaturization of IoT for wireless power transfer solutions HM Torun, C Pardue, MLF Belleradj, AK Davis, M Swaminathan 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2374-2381, 2018 | 14 | 2018 |
| Multicomponent material property characterization of atherosclerotic human carotid arteries through a Bayesian Optimization based inverse finite element approach SG Torun, HM Torun, HHG Hansen, CL de Korte, AFW van der Steen, ... journal of the mechanical behavior of biomedical materials 126, 104996, 2022 | 12 | 2022 |
Madhavan SwaminathanDept Head EE; William E. Leonhard Endowed Chair; Director CHIMES (an SRC JUMP 2.0 Center) Penn StateVerified email at psu.edu