| Effect of Ni content on the diffusion-controlled growth of the product phases in the Cu (Ni)–Sn system VA Baheti, S Islam, P Kumar, R Ravi, R Narayanan, D Hongqun, ... Philosophical Magazine 96 (1), 15-30, 2016 | 38 | 2016 |
| The impact of residual stress on resonating piezoelectric devices G Ross, H Dong, CB Karuthedath, AT Sebastian, T Pensala, ... Materials & Design 196, 109126, 2020 | 31 | 2020 |
| Solid-state reaction of electroplated thin film Au/Sn couple at low temperatures H Xu, V Vuorinen, H Dong, M Paulasto-Kröckel Journal of Alloys and Compounds 619, 325-331, 2015 | 28 | 2015 |
| Thermodynamic reassessment of Au–Ni–Sn ternary system HQ Dong, V Vuorinen, T Laurila, M Paulasto-Kröckel Calphad 43, 61-70, 2013 | 24 | 2013 |
| Thermodynamic modeling of Au–Ce–Sn ternary system HQ Dong, XM Tao, T Laurila, V Vuorinen, M Paulasto-Kröckel Calphad 42, 38-50, 2013 | 24 | 2013 |
| Thermodynamic reassessment of Au–Cu–Sn ternary system HQ Dong, V Vuorinen, XM Tao, T Laurila, M Paulasto-Kröckel Journal of alloys and compounds 588, 449-460, 2014 | 21 | 2014 |
| Role of different factors affecting interdiffusion in Cu (Ga) and Cu (Si) solid solutions S Santra, H Dong, T Laurila, A Paul Proceedings of the Royal Society A: Mathematical, Physical and Engineering …, 2014 | 19 | 2014 |
| Effect of Ti on the interfacial reaction between Sn and Cu V Vuorinen, HQ Dong, T Laurila Journal of Materials Science: Materials in Electronics 23, 68-74, 2012 | 19 | 2012 |
| Thermodynamic assessment of the Al–Cu–Gd system LG Zhang, HQ Dong, GX Huang, J Shan, LB Liu, ZP Jin Calphad 33 (4), 664-672, 2009 | 19 | 2009 |
| Wafer level solid liquid Interdiffusion bonding: formation and evolution of microstructures V Vuorinen, H Dong, G Ross, J Hotchkiss, J Kaaos, M Paulasto-Kröckel Journal of Electronic Materials 50, 818-824, 2021 | 18 | 2021 |
| Microstructural evolution and mechanical properties of Au-20wt.% Sn| Ni interconnection HQ Dong, V Vuorinen, XW Liu, T Laurila, J Li, M Paulasto-Kröckel Journal of Electronic Materials 45, 566-575, 2016 | 18 | 2016 |
| Microstructural Evolution and Mechanical Properties in (AuSn)eut-Cu Interconnections H Dong, V Vuorinen, T Laurila, M Paulasto-Kröckel Journal of Electronic Materials 45, 5478-5486, 2016 | 16 | 2016 |
| Thermodynamic analysis of the La–Mg–Ni bulk metallic glass system LG Zhang, HQ Dong, JF Nie, FG Meng, S Jin, LB Liu, ZP Jin Journal of alloys and compounds 491 (1-2), 123-130, 2010 | 16 | 2010 |
| Thermodynamic assessment of the Au-Co-Sn ternary system HQ Dong, S Jin, LG Zhang, JS Wang, XM Tao, HS Liu, ZP Jin Journal of electronic materials 38, 2158-2169, 2009 | 16 | 2009 |
| Diffusion and Growth of the μ Phase (Ni6Nb7) in the Ni-Nb System SSK Balam, HQ Dong, T Laurila, V Vuorinen, A Paul Metallurgical and Materials Transactions A 42, 1727-1731, 2011 | 14 | 2011 |
| Thermodynamic assessment of Au–Ho and Au–Tm binary systems HQ Dong, XM Tao, T Laurila, M Paulasto-Kröckel Calphad 37, 87-93, 2012 | 13 | 2012 |
| Thermodynamic assessment of Au–La and Au–Er binary systems HQ Dong, XM Tao, HS Liu, T Laurila, M Paulastro-Kröckel Journal of alloys and compounds 509 (13), 4439-4444, 2011 | 12 | 2011 |
| Thermodynamic assessment of the Sn–Ag–Co system and solidification simulation of the ternary alloy WJ Zhu, HS Liu, JS Wang, HQ Dong, ZP Jin Journal of alloys and compounds 481 (1-2), 503-508, 2009 | 12 | 2009 |
| First-principles calculations assisted thermodynamic assessment of the Pt–Ga–Ge ternary system JS Wang, S Jin, WJ Zhu, HQ Dong, XM Tao, HS Liu, ZP Jin Calphad 33 (3), 561-569, 2009 | 11 | 2009 |
| Thermodynamic reassessment of the Au-Pt-Sn system and microstructural evolution of the (AuSn) eut-Pt interconnection H Dong, V Vuorinen, M Broas, M Paulasto-Kröckel Journal of Alloys and Compounds 688, 388-398, 2016 | 10 | 2016 |
