| In situ 3D nanoprinting of free-form coupling elements for hybrid photonic integration PI Dietrich, M Blaicher, I Reuter, M Billah, T Hoose, A Hofmann, C Caer, ... Nature Photonics 12 (4), 241-247, 2018 | 383 | 2018 |
| Hybrid integration of silicon photonics circuits and InP lasers by photonic wire bonding MR Billah, M Blaicher, T Hoose, PI Dietrich, P Marin-Palomo, ... Optica 5 (7), 876-883, 2018 | 264 | 2018 |
| Hybrid multi-chip assembly of optical communication engines by in situ 3D nano-lithography M Blaicher, MR Billah, J Kemal, T Hoose, P Marin-Palomo, A Hofmann, ... Light: Science & Applications 9 (1), 71, 2020 | 154 | 2020 |
| Optical coherence tomography system mass-producible on a silicon photonic chip S Schneider, M Lauermann, PI Dietrich, C Weimann, W Freude, C Koos Optics express 24 (2), 1573-1586, 2016 | 90 | 2016 |
| Printed freeform lens arrays on multi-core fibers for highly efficient coupling in astrophotonic systems PI Dietrich, RJ Harris, M Blaicher, MK Corrigan, TJ Morris, W Freude, ... Optics express 25 (15), 18288-18295, 2017 | 67 | 2017 |
| Tailored probes for atomic force microscopy fabricated by two-photon polymerization G Göring, PI Dietrich, M Blaicher, S Sharma, JG Korvink, T Schimmel, ... Applied Physics Letters 109 (6), 2016 | 49 | 2016 |
| Custom-designed glassy carbon tips for atomic force microscopy A Zakhurdaeva, PI Dietrich, H Hölscher, C Koos, JG Korvink, S Sharma Micromachines 8 (9), 285, 2017 | 45 | 2017 |
| Hybrid external-cavity lasers (ECL) using photonic wire bonds as coupling elements Y Xu, P Maier, M Blaicher, PI Dietrich, P Marin-Palomo, W Hartmann, ... Scientific reports 11 (1), 16426, 2021 | 41 | 2021 |
| 3D‐printed scanning‐probe microscopes with integrated optical actuation and read‐out PI Dietrich, G Göring, M Trappen, M Blaicher, W Freude, T Schimmel, ... Small 16 (2), 1904695, 2020 | 32 | 2020 |
| Method for producing an optical system and optical system PI Dietrich, C Koos, M Blaicher, I Reuter, XU Yilin US Patent 11,169,446, 2021 | 30 | 2021 |
| Multi-chip integration of lasers and silicon photonics by photonic wire bonding M Billah, T Hoose, T Onanuga, N Lindenmann, P Dietrich, T Wingert, ... CLEO: Science and Innovations, STu2F. 2, 2015 | 30 | 2015 |
| 3D-printed optical probes for wafer-level testing of photonic integrated circuits M Trappen, M Blaicher, PI Dietrich, C Dankwart, Y Xu, T Hoose, MR Billah, ... Optics Express 28 (25), 37996-38007, 2020 | 28 | 2020 |
| 3D-printed facet-attached microlenses for advanced photonic system assembly Y Xu, P Maier, M Trappen, PI Dietrich, M Blaicher, R Jutas, A Weber, ... Light: Advanced Manufacturing 4 (2), 77-93, 2023 | 27 | 2023 |
| Micro-lens arrays as tip-tilt sensor for single mode fiber coupling P Hottinger, RJ Harris, PI Dietrich, M Blaicher, M Glück, A Bechter, J Crass, ... Advances in Optical and Mechanical Technologies for Telescopes and …, 2018 | 26 | 2018 |
| 8-channel 448 Gbit/s silicon photonic transmitter enabled by photonic wire bonding MR Billah, M Blaicher, JN Kemal, T Hoose, H Zwickel, PI Dietrich, ... Optical Fiber Communication Conference, Th5D. 6, 2017 | 25 | 2017 |
| Sub-kHz-Linewidth External-Cavity Laser (ECL) With Si3N4 Resonator Used as a Tunable Pump for a Kerr Frequency Comb P Maier, Y Chen, Y Xu, Y Bao, M Blaicher, D Geskus, R Dekker, J Liu, ... Journal of Lightwave Technology 41 (11), 3479-3490, 2023 | 22 | 2023 |
| Multi-chip integration by photonic wire bonding: Connecting surface and edge emitting lasers to silicon chips T Hoose, M Billah, M Blaicher, P Marin, PI Dietrich, A Hofmann, ... Optical Fiber Communication Conference, M2I. 7, 2016 | 21 | 2016 |
| Broadly tunable microcomputer-controlled color-center laser for intracavity and extracavity sub-Doppler spectroscopy H Adams, R Brüggemann, P Dietrich, D Kirsten, H Solka, W Urban JOSA B 2 (5), 815-828, 1985 | 19 | 1985 |
| 1. Bringing Accuracy to Open Virtual Platforms (OVP): A Safari from High-Level Tools to Low-Level Microarchitectures GSP Delicia, T Bruckschloegl, P Figuli, C Tradowsky, GM Almeida, ... Opt. Express 26, 220-232, 2018 | 18 | 2018 |
| Lenses for low-loss chip-to-fiber and fiber-to-fiber coupling fabricated by 3D direct-write lithography PI Dietrich, I Reuter, M Blaicher, S Schneider, M Billah, T Hoose, ... CLEO: Science and Innovations, SM1G. 4, 2016 | 18 | 2016 |
