| Drop impact survey of portable electronic products CT Lim, CW Ang, LB Tan, SKW Seah, EH Wong | 148 | 2003 |
| Performance of an advanced combat helmet with different interior cushioning systems in ballistic impact: Experiments and finite element simulations LB Tan, KM Tse, HP Lee, VBC Tan, SP Lim International Journal of Impact Engineering 50, 99-112, 2012 | 113 | 2012 |
| Development of a finite element head model for the study of impact head injury B Yang, KM Tse, N Chen, LB Tan, QQ Zheng, HM Yang, M Hu, G Pan, ... BioMed research international 2014 (1), 408278, 2014 | 89 | 2014 |
| Stress analysis of multi-layered hollow anisotropic composite cylindrical structures using the homogenization method XS Sun, VBC Tan, Y Chen, LB Tan, RK Jaiman, TE Tay Acta Mechanica 225, 1649-1672, 2014 | 74 | 2014 |
| A review on acoustic black-holes (ABH) and the experimental and numerical study of ABH-featured 3D printed beams BMP Chong, LB Tan, KM Lim, HP Lee International Journal of Applied Mechanics 9 (06), 1750078, 2017 | 65 | 2017 |
| Development and validation of two subject‐specific finite element models of human head against three cadaveric experiments KM Tse, LB Tan, SJ Lee, SP Lim, HP Lee International journal for numerical methods in biomedical engineering 30 (3 …, 2014 | 59 | 2014 |
| Effect of full helmet systems on human head responses under blast loading M Rodríguez-Millán, LB Tan, KM Tse, HP Lee, MH Miguelez Materials & Design 117, 58-71, 2017 | 54 | 2017 |
| Material characterization of filament-wound composite pipes W Toh, LB Tan, KM Tse, A Giam, K Raju, HP Lee, VBC Tan Composite Structures 206, 474-483, 2018 | 51 | 2018 |
| Investigation of the relationship between facial injuries and traumatic brain injuries using a realistic subject-specific finite element head model KM Tse, LB Tan, SJ Lee, SP Lim, HP Lee Accident Analysis & Prevention 79, 13-32, 2015 | 48 | 2015 |
| Effect of helmet liner systems and impact directions on severity of head injuries sustained in ballistic impacts: a finite element (FE) study KM Tse, LB Tan, B Yang, VBC Tan, HP Lee Medical & biological engineering & computing 55, 641-662, 2017 | 43 | 2017 |
| A comprehensive study on composite risers: Material solution, local end fitting design and global response W Toh, LB Tan, RK Jaiman, TE Tay, VBC Tan Marine Structures 61, 155-169, 2018 | 42 | 2018 |
| Board level solder joint failures by static and dynamic loads LB Tan, SKW Seah, EH Wong, X Zhang, VBC Tan, CT Lim Proceedings of the 5th Electronics Packaging Technology Conference (EPTC …, 2003 | 39 | 2003 |
| Advanced analysis of WLCSP copper interconnect reliability under board level drop test TY Tee, BT Long, R Anderson, SN Hun, JH Low, CP Khoo, R Moody, ... 2008 10th Electronics Packaging Technology Conference, 1086-1095, 2008 | 38 | 2008 |
| Zheng, Q B Yang, KM Tse, N Chen, LB Tan Q., Yang, H.-M., Hu, M., Pan, G., and Lee, H.-P, 408278, 2014 | 37 | 2014 |
| Impact of complex blast waves on the human head: a computational study LB Tan, FS Chew, KM Tse, VB Chye Tan, HP Lee International journal for numerical methods in biomedical engineering 30 (12 …, 2014 | 33 | 2014 |
| Coupled fluid–structure simulations for evaluating a performance of full-scale deepwater composite riser LB Tan, Y Chen, RK Jaiman, X Sun, VBC Tan, TE Tay Ocean Engineering 94, 19-35, 2015 | 31 | 2015 |
| Rate-dependent properties of Sn–Ag–Cu based lead-free solder joints for WLCSP YA Su, LB Tan, TY Tee, VBC Tan Microelectronics Reliability 50 (4), 564-576, 2010 | 31 | 2010 |
| Modal and impact analysis of modern portable electronic products LB Tan, CW Ang, CT Lim, VBC Tan, X Zhang Proceedings Electronic Components and Technology, 2005. ECTC'05., 645-653, 2005 | 30 | 2005 |
| Integrated testing, modeling and failure analysis of CSPnl for enhanced board level reliability R Anderson, TY Tee, LB Tan, HS Ng, JH Low, CP Khoo, R Moody, ... International Wafer-Level Packaging Conference, 184-190, 2008 | 22 | 2008 |
| Novel plenum window with sonic crystals for indoor noise control HM Lee, Z Wang, KM Lim, J Xie, HP Lee Applied Acoustics 167, 107390, 2020 | 21 | 2020 |
Heow Pueh LeeMechanical Engineering, National University of SingaporeVerified email at nus.edu.sg