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Baowen LiSouthern University of Science and Technology, University of Colorado, Boulder, National UniversityVerified email at sustech.edu.cn
Cheng-Wei QIUProvost's Chair Professor, National University of SingaporeVerified email at nus.edu.sg
JTL ThongProfessor, Singapore Institute of TechnologyVerified email at SingaporeTech.edu.sg
Tiancheng HanSchool of Physical Science and Technology, Southwest University, Chongqing 400715, ChinaVerified email at swu.edu.cn
Dongliang GaoSoochow UniversityVerified email at suda.edu.cn
Tianzhi YangProfessor, Northeastern University, TU-DarmstadtVerified email at me.neu.edu.cn
Jian-Bin XU 许建斌Chinese University of Hong Kong (CUHK); Shenzhen Institutes of Advanced Technology (SIAT), CASVerified email at ee.cuhk.edu.hk
Ying LiZhejiang UniversityVerified email at zju.edu.cn
Xiangfan XUCenter for Phononics and Thermal Energy Science, Tongji UniversityVerified email at tongji.edu.cn
Meng HanShenzhen Institute of Advanced TechnologyVerified email at siat.ac.cn
Jing WuProfessor, School of Electronic Science & Engineering, Southeast University, ChinaVerified email at seu.edu.cn
Yimin Yao (么依民)PhD, Associate Researcher, SIEM, SIAT, CASVerified email at siat.ac.cn
Yu ChenResearch Scientist, Commonwealth Scientific and Industrial Research Organisation (CSIRO)Verified email at e.ntu.edu.sg
Yumeng YangShanghaiTech UniversityVerified email at shanghaitech.edu.cn
Xiang ZHANGUniversity of Hong KongVerified email at hku.hk
Jun LiuSichuan UniversityVerified email at scu.edu.cn
Xiangying ShenSouthern University of Science and TechnologyVerified email at sustech.edu.cn