| Lateral layered semiconductor multijunctions for novel electronic devices S Zhang, X Deng, Y Wu, Y Wang, S Ke, S Zhang, K Liu, R Lv, Z Li, ... Chemical Society Reviews 51 (10), 4000-4022, 2022 | 16 | 2022 |
| Gamma-phase CsPbBr3 perovskite nanocrystals/polymethyl methacrylate electrospun nanofibrous membranes with superior photo-catalytic property Q Zhang, X Deng, C Tan, Y Zhou, X Chen, X Bai, J Li, B Tang, S Li, H Lin The Journal of Chemical Physics 153 (2), 2020 | 16 | 2020 |
| Controllable synthesis of peapod-like TiO 2@ GO@ C electrospun nanofiber membranes with enhanced mechanical properties and photocatalytic degradation abilities towards … Q Zhang, X Chen, H Wang, X Bai, X Deng, Q Yao, J Wang, B Tang, W Lin, ... New Journal of Chemistry 44 (9), 3755-3763, 2020 | 15 | 2020 |
| All-Optical Reconfigurable Excitonic Charge States in Monolayer MoS2 GY Huang, L Lin, S Zhao, W Li, X Deng, S Zhang, C Wang, XZ Li, Y Zhang, ... Nano Letters 23 (4), 1514-1521, 2023 | 11 | 2023 |
| Emerging probing perspective of two-dimensional materials physics: terahertz emission spectroscopy Y Wu, Y Wang, D Bao, X Deng, S Zhang, L Yu-Chun, S Ke, J Liu, Y Liu, ... Light: Science & Applications 13 (1), 146, 2024 | 6 | 2024 |
| Comparative coherence between layered and traditional semiconductors: unique opportunities for heterogeneous integration Z Chen, X Deng, S Zhang, Y Wang, Y Wu, S Ke, J Zhang, F Liu, J Liu, ... International Journal of Extreme Manufacturing 5 (4), 042001, 2023 | 5 | 2023 |
| Highly Processable wTSV Modular Manufacturing for Next Generation 3D MEMS/NEMS Integrated System S Zhang, X Deng, Y Wang, Y Wu, S Ke, L Li, C Xing, Z Li, C Wang 2022 China Semiconductor Technology International Conference (CSTIC), 1-4, 2022 | 1 | 2022 |
| TSV Integrated and Pattern Recognition Based Multimode Degenerated Low-Power 3-Dimensional Smart Sensing Chips S Zhang, X Deng, Y Wang, Y Wu, S Ke, J Liu, Y Lin, Z Wang, Z Li, C Wang 2024 Conference of Science and Technology for Integrated Circuits (CSTIC), 1-4, 2024 | | 2024 |
