| Grain refinement in highly undercooled solidification of Ni85Cu15 alloy melt: Direct evidence for recrystallization mechanism T Zhang, F Liu, HF Wang, GC Yang Scripta Materialia 63 (1), 43-46, 2010 | 67 | 2010 |
| Deciphering the transformation pathway in laser powder-bed fusion additive manufacturing of Ti-6Al-4V alloy J Chen, D Fabijanic, T Zhang, EW Lui, M Brandt, W Xu Additive Manufacturing 58, 103041, 2022 | 42 | 2022 |
| Kinetics of diffusion-controlled transformations: Application of probability calculation H Wang, F Liu, T Zhang, G Yang, Y Zhou Acta materialia 57 (10), 3072-3083, 2009 | 21 | 2009 |
| Superior low temperature toughness in a newly designed low Mn and low Ni high strength steel L Jiang, J Wang, T Zhang, T Dorin, X Sun Materials Science and Engineering: A 825, 141899, 2021 | 17 | 2021 |
| High-purity nickel prepared by electron beam melting: purification mechanism T Zhang, Z Shang, M Chen, J He, B Lv, X Wang, X Xiong Metallurgical and Materials Transactions B 45, 164-174, 2014 | 15 | 2014 |
| Rod eutectic growth in bulk undercooled melts J Xu, T Zhang, PK Galenko Mathematical Methods in the Applied Sciences 45 (13), 8022-8031, 2022 | 2 | 2022 |
| The effect of superheat on the nucleation undercooling of metallic melts J Xu, D Fan, T Zhang Mathematical Methods in the Applied Sciences 44 (16), 12351-12359, 2021 | 2 | 2021 |
| Purification of nickel ingot prepared by electron beam melting Z Shang, T Zhang, M Chen, X Zhu, H Liu, J He CHINESE JOURNAL OF RARE METALS 37 (1), 116-122, 2013 | 2 | 2013 |
| On the eutectic transition of undercooled hypoeutectic Ni-B alloy in the differing heat extraction process J Xu, T Zhang Materials Letters: X 13, 100128, 2022 | 1 | 2022 |
| Identification of the heat source and thermal material model parameters for the laser engineered net shaping L Hajder, T Zhang, V Nguyen Computer Methods in Materials Science 22, 2022 | | 2022 |
| Microstructures in additively manufactured Inconel 718 T Zhang Deakin University, 2021 | | 2021 |
| Solid Phase Transition of Cold-Rolling Au-44% Cu Alloy T Zhang, M Chen, S Liu, C Zhang, T Dong, X Sun CHINESE JOURNAL OF RARE METALS 38 (6), 978-985, 2014 | | 2014 |
| High-purity Vanadium Products used in Microelectronics T Zhang, Q Zhang, X Wan, H Cao, T Dong, Y Li, M Chen, X Wang | | |
Jun WangDeakin UniversityVerified email at deakin.edu.au