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Nelson TansuHead of School & Professor, School of Electrical & Mechanical Engineering [EEE, ME, & BME]Verified email at adelaide.edu.au
Hongping ZhaoProfessor of Electrical & Computer Engineering, Materials Science & Engineering, OSUVerified email at osu.edu
Jing ZhangAssociate Professor, Rochester Institute of TechnologyVerified email at rit.edu
Boon S. OoiKing Abdullah University of Science & Technology (KAUST)Verified email at kaust.edu.sa
Tien Khee NgPrincipal Scientist, KAUST; Fellow of IET, Fellow of IOPVerified email at kaust.edu.sa
Xiaohang LiAssociate Professor, Advanced Semiconductor Lab, ECE, CEMSEVerified email at kaust.edu.sa
Volkmar DierolfLehigh UniversityVerified email at lehigh.edu
Jonathan D. PoplawskyOak Ridge National LaboratoryVerified email at ornl.gov
Ronald ArifLehigh University, II-VI, Cree, Veeco, ThermoFisherVerified email at thermofisher.com
Chun Hong KangKing Abdullah University of Science and Technology (KAUST)Verified email at kaust.edu.sa
Chao ShenFudan UniversityVerified email at ieee.org
Chee-Keong TanAssistant Professor, Hong Kong University of Science and Technology (Guangzhou)Verified email at ust.hk
Prof. Mohamed-Slim AlouiniWireless CT Lab, King Abdullah University of Science and Technology (KAUST), Kingdom of Saudi ArabiaVerified email at kaust.edu.sa
Kang-Ting HoKAUSTVerified email at kaust.edu.sa
Hassan Makine OubeiKing Abdullah University of Science and TechnologyVerified email at kaust.edu.sa
Peifen ZhuUniversity of MissouriVerified email at missouri.edu
Jim SpeckProfessor of Materials, UCSBVerified email at ucsb.edu
Davide PrianteCoherent Corp.Verified email at unm.edu
Chao ZhaoProfessor, Institute of Semiconductors, Chinese Academy of Sciences; Fellow of IOPVerified email at semi.ac.cn
Mohamed EbaidBerkeley LabVerified email at lbl.gov