| Encapsulation technologies for electronic applications H Ardebili, J Zhang, MG Pecht William Andrew, 2018 | 267 | 2018 |
| Improved predictions of lead free solder joint reliability that include aging effects M Motalab, Z Cai, JC Suhling, J Zhang, JL Evans, MJ Bozack, P Lall 2012 IEEE 62nd Electronic Components and Technology Conference, 513-531, 2012 | 144 | 2012 |
| Thermal Aging Effects on the Thermal Cycling Reliability of Lead-Free Fine Pitch Packages J Zhang, Z Hai, S Thirugnanasambandam, JL Evans, MJ Bozack, Y Zhang, ... Components, Packaging and Manufacturing Technology, IEEE Transactions on 3 …, 2013 | 135 | 2013 |
| Correlation of reliability models including aging effects with thermal cycling reliability data M Motalab, M Mustafa, JC Suhling, J Zhang, J Evans, MJ Bozack, P Lall 2013 IEEE 63rd Electronic Components and Technology Conference, 986-1004, 2013 | 131 | 2013 |
| Correlation of Aging Effects on Creep Rate and Reliability in Lead Free Solder Joints JCS Jiawei Zhang, Zhou Hai, Sivasubramanian Orlando, F. L. "Journal of Surface Mount Technology." (2012). 25 (3), 19-28, 2012 | 131* | 2012 |
| LONG-TERM AGING EFFECTS ON THE RELIABILITY OF LEAD FREE SOLDER JOINTS IN BALL GRID ARRAY PACKAGES WITH VARIOUS PITCH SIZES AND BALL ALIGNMENTS JLE Cong Zhao, Chaobo Shen, Zhou Hai, Jiawei Zhang, MJ Bozack Journal of Surface Mount Technology 29 (2), 37-46, 2016 | 68* | 2016 |
| Reliability Comparison of Aged SAC Fine-Pitch Ball Grid Array Packages Versus Surface Finishes CS John Evans Zhou (Joe) Hai, Jiawei Zhang Components, Packaging and Manufacturing Technology, IEEE Transactions on 5 …, 2015 | 66* | 2015 |
| Impact of Isothermal Aging on the Long-Term Reliability of Fine-Pitch Ball Grid Array Packages With Different Sn-Ag-Cu Solder Joints J Zhang, S Thirugnanasambandam, JL Evans, MJ Bozack, R Sesek Components, Packaging and Manufacturing Technology, IEEE Transactions on 2 …, 2012 | 47 | 2012 |
| Reliability Degradation of SAC105 and SAC305 BGA Packages Under Long-Term, High Temperature Aging JLE Zhou Hai, Jiawei Zhang, Chaobo Shen, E. K. Snipes, J. C. Suhling, M. J ... Orlando, F. L. "Journal of Surface Mount Technology." (2014). 27 (2), 11-18, 2014 | 41* | 2014 |
| Packaging reliability effect of ENIG and ENEPIG surface finishes in board level thermal test under long-term aging and cycling C Shen, Z Hai, C Zhao, J Zhang, JL Evans, MJ Bozack, JC Suhling Materials 10 (5), 451, 2017 | 35 | 2017 |
| The effect of iso-thermal aging on vibrational performance of SAC 105 and 305 alloys N Vijayakumar, S Thirugnanasambandam, P Soobramaney, J Zhang, ... 2013 IEEE International Symposium on Advanced Packaging Materials, 69-81, 2013 | 16 | 2013 |
| Long-term Aging Effects on Reliability Performance of Lead-Free Solder Joints M. J. Bozack, and Richard Sesek Zhou Hai, Jiawei SMTA International Conference Proceedings 2013, 362-370, 2013 | 15* | 2013 |
| Tin-bismuth plating for component finishes R Zhang, J Zhang, J Evans, W Johnson, J Vardaman, I Fujimura, A Tseng, ... 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2060-2066, 2011 | 14 | 2011 |
| Component level reliability on different dimensions of lead free wafer level chip scale packages subjected to extreme temperatures S Thirugnanasambandam, J Zhang, J Evans, F Xie, M Perry, B Lewis, ... 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012 | 12 | 2012 |
| AGING EFFECTS ON CREEP BEHAVIORS OF LEAD-FREE SOLDER JOINTS AND RELIABILITY OF FINE-PITCH PACKAGES J Zhang, Z Hai, S Thirugnanasambandam, JL Evans, MJ Bozack, R Sesek, ... SMTA International Conference Proceedings 2012, 2012 | 11 | 2012 |
| DROP RELIABILITY TEST ON DIFFERENT DIMENSIONAL LEAD-FREE WAFER LEVEL CHIP SCALE PACKAGES S Thirugnanasambandam, N Vijayakumar, J Zhang, J Evans, F Xie, ... | 11 | 2012 |
| Sn-Ag-Cu Solder Joints Interconnection Reliability of BGA Package during Thermal Aging and Cycling JCS Chaobo Shen, Cong Zhao, Zhou Hai, Jiawei Zhang, M. J. Bozack 48th International Symposium on Microelectronics, 2015 | 6 | 2015 |
| Isothermal Aging Effects on the Thermal Reliability Performance of Lead-Free Solder Joints JLE Jiawei Zhang, Zhou Hai, Sivasubramanian 45th International Symposium on Microelectronics, 000801-000808 BEST PAPER, 2012 | 6 | 2012 |
| Isothermal Aging Effects on the Harsh Environment Performance of Lead-Free Solder J Zhang, Z Hai, S Thirugnanasambandam, JL Evans, MJ Bozack proc. 45th International Symposium on Microelectronics, 000801-000808, 2012 | 6 | 2012 |
| Reexamination of Thermal Cycling Reliability of BGA Components with SNAGCU and SnPb Solder Joints on Different Board Designs S Su, F Akkara, T Sanders, J Zhang, J Evans, G Harris 2020 Pan Pacific Microelectronics Symposium (Pan Pacific), 2020 | 5 | 2020 |