| Prediction of surface roughness based on a hybrid feature selection method and long short-term memory network in grinding W Guo, C Wu, Z Ding, Q Zhou The International Journal of Advanced Manufacturing Technology 112, 2853-2871, 2021 | 145 | 2021 |
| Surface roughness modeling for grinding of silicon carbide ceramics considering co-existence of brittleness and ductility C Wu, B Li, Y Liu, SY Liang International Journal of Mechanical Sciences 133, 167-177, 2017 | 97 | 2017 |
| Damage evolution and removal behaviors of GaN crystals involved in double-grits grinding C Li, Y Hu, Z Wei, C Wu, Y Peng, F Zhang, Y Geng International Journal of Extreme Manufacturing 6 (2), 025103, 2024 | 96 | 2024 |
| Smoothed particle hydrodynamics simulation and experimental analysis of SiC ceramic grinding mechanism Y Liu, B Li, C Wu, L Kong, Y Zheng Ceramics International 44 (11), 12194-12203, 2018 | 80 | 2018 |
| High-speed grinding of HIP-SiC ceramics on transformation of microscopic features C Wu, J Pang, B Li, SY Liang The International Journal of Advanced Manufacturing Technology 102, 1913-1921, 2019 | 77 | 2019 |
| Simulation-based evaluation of surface micro-cracks and fracture toughness in high-speed grinding of silicon carbide ceramics Y Liu, B Li, C Wu, Y Zheng The International Journal of Advanced Manufacturing Technology 86, 799-808, 2016 | 72 | 2016 |
| Prediction of grinding force for brittle materials considering co-existing of ductility and brittleness C Wu, B Li, J Yang, SY Liang The International Journal of Advanced Manufacturing Technology 87, 1967-1975, 2016 | 55 | 2016 |
| A critical energy model for brittle–ductile transition in grinding considering wheel speed and chip thickness effects C Wu, B Li, SY Liang Proceedings of the Institution of Mechanical Engineers, Part B: Journal of …, 2016 | 40 | 2016 |
| High-speed grinding fracture mechanism of Cf/SiC composite considering interfacial strength and anisotropy M Guo, J Tao, C Wu, C Luo, Z Lin Ceramics International 49 (2), 2600-2612, 2023 | 39 | 2023 |
| Single diamond scribing of SiCf/SiC composite: Force and material removal mechanism study Y Liu, Y Quan, C Wu, L Ye, X Zhu Ceramics International 47 (19), 27702-27709, 2021 | 39 | 2021 |
| An effective defect detection method based on improved Generative Adversarial Networks (iGAN) for machined surfaces Q Wang, R Yang, C Wu, Y Liu Journal of Manufacturing Processes 65, 373-381, 2021 | 38 | 2021 |
| Laser-assisted grinding of silicon nitride ceramics: micro-groove preparation and removal mechanism C Wu, T Zhang, W Guo, X Meng, Z Ding, SY Liang Ceramics International 48 (21), 32366-32379, 2022 | 37 | 2022 |
| Thermal analysis of 3J33 grinding under minimum quantity lubrication condition Z Ding, J Sun, W Guo, X Jiang, C Wu, SY Liang International Journal of Precision Engineering and Manufacturing-Green …, 2021 | 30 | 2021 |
| Strain rate-sensitive analysis for grinding damage of brittle materials C Wu, B Li, Y Liu, J Pang, SY Liang The International Journal of Advanced Manufacturing Technology 89, 2221-2229, 2017 | 26 | 2017 |
| Comprehensive effect of multi-parameters on vibration in high-speed precision milling M Guo, Y Ye, X Jiang, C Wu The International Journal of Advanced Manufacturing Technology 108, 2187-2195, 2020 | 23 | 2020 |
| An integrated machine-process-controller model to predict milling surface topography considering vibration suppression MX Guo, J Liu, LM Pan, CJ Wu, XH Jiang, WC Guo Advances in Manufacturing 10 (3), 443-458, 2022 | 19 | 2022 |
| Ductile grinding of Silicon carbide in high speed grinding C Wu, B Li, J Pang, SY Liang Journal of Advanced Mechanical Design, Systems, and Manufacturing 10 (2 …, 2016 | 18 | 2016 |
| Heat flux distribution and temperature prediction model for dry and wet cylindrical plunge grinding J Pang, C Wu, Y Shen, S Liu, Q Wang, B Li Proceedings of the Institution of Mechanical Engineers, Part B: Journal of …, 2019 | 17 | 2019 |
| Thermal effect on oxidation layer evolution and phase transformation in grinding of Fe-Ni super alloy C Wu, W Guo, R Li, Y Zhao, Q Zhou Materials letters 275, 128072, 2020 | 16 | 2020 |
| Heat flux distribution model in the cylindrical grinding contact area J Pang, B Li, Y Liu, C Wu Procedia Manufacturing 5, 158-169, 2016 | 16 | 2016 |
