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Yan ZhouThe Chinese University of Hong Kong (shenzhen)Verified email at cuhk.edu.cn
Jing XiaShinshu UniversityVerified email at shinshu-u.ac.jp
Motohiko EzawaUniversity of TokyoVerified email at ap.t.u-tokyo.ac.jp
Xiaoxi LiuProfessor, Faculty of Engineering, Shinshu UniversityVerified email at cs.shinshu-u.ac.jp
Weisheng ZhaoFert Beijing Institute, Beihang UniversityVerified email at buaa.edu.cn
Wang KangBeihang UniversityVerified email at buaa.edu.cn
Oleg A. TretiakovAssociate Professor, University of New South WalesVerified email at unsw.edu.au
Laichuan ShenThe Chinese University of Hong Kong, ShenzhenVerified email at cuhk.edu.cn
Seonghoon WooAmogy, IBM, KIST, MITVerified email at amogy.co
Jiang WanjunDepartment of Physics, Tsinghua UniversityVerified email at tsinghua.edu.cn
Kang L. WangElectrical Engineering DepartmentVerified email at ee.ucla.edu
Jörg RaabeGroup Leader, Paul Scherrer InstitutVerified email at psi.ch
Simone FinizioPaul Scherrer InstitutVerified email at psi.ch
Na Lei北航集成电路科学与工程学院Verified email at buaa.edu.cn
Tae-Eon Park한국과학기술연구원Verified email at kist.re.kr
Daoqian Zhu (朱道乾)Beihang University, ChinaVerified email at buaa.edu.cn
Guoqiang YuInstitute of Physics, Chinese Academy of SciencesVerified email at iphy.ac.cn
Suzanne G.E. te VelthuisArgonne National LaboratoryVerified email at anl.gov
Axel HoffmannProfessor of Materials Science and Engineering, University of Illinois at Urbana-ChampaignVerified email at illinois.edu
Sai LiBeihang universityVerified email at buaa.edu.cn