| Impedance analysis for condition monitoring of single lap CNT-epoxy adhesive joint O Sam-Daliri, LM Faller, M Farahani, A Roshanghias, A Araee, ... International Journal of Adhesion and Adhesives 88, 59-65, 2019 | 60 | 2019 |
| Sintering strategies for inkjet printed metallic traces in 3D printed electronics A Roshanghias, M Krivec, M Baumgart Flexible and Printed Electronics 2 (4), 045002, 2017 | 57 | 2017 |
| Inkjet printing and characterisation of a resistive temperature sensor on paper substrate J Zikulnig, C Hirschl, L Rauter, M Krivec, H Lammer, F Riemelmoser, ... Flexible and Printed Electronics 4 (1), 015008, 2019 | 54 | 2019 |
| Exploiting the combination of 3D polymer printing and inkjet Ag-nanoparticle printing for advanced packaging M Krivec, A Roshanghias, A Abram, A Binder Microelectronic Engineering 176, 1-5, 2017 | 48 | 2017 |
| Morphology and shear strength of lead-free solder joints with Sn3. 0Ag0. 5Cu solder paste reinforced with ceramic nanoparticles A Yakymovych, Y Plevachuk, P Švec, P Švec, D Janičkovič, P Šebo, ... Journal of Electronic Materials 45, 6143-6149, 2016 | 45 | 2016 |
| MWCNT–epoxy nanocomposite sensors for structural health monitoring O Sam-Daliri, LM Faller, M Farahani, A Roshanghias, H Oberlercher, ... Electronics 7 (8), 143, 2018 | 43 | 2018 |
| Flip Chip integration of ultra-thinned dies in low-cost flexible printed electronics; the effects of die thickness, encapsulation and conductive adhesives MH Malik, G Grosso, H Zangl, A Binder, A Roshanghias Microelectronics Reliability 123, 114204, 2021 | 39 | 2021 |
| Nano-porous aluminum oxide membrane as filtration interface for optical gas sensor packaging Y Ma, J Kaczynski, C Ranacher, A Roshanghias, M Zauner, B Abasahl Microelectronic Engineering 198, 29-34, 2018 | 39 | 2018 |
| Sn–Ag–Cu nanosolders: melting behavior and phase diagram prediction in the Sn-rich corner of the ternary system A Roshanghias, J Vrestal, A Yakymovych, KW Richter, H Ipser Calphad 49, 101-109, 2015 | 38 | 2015 |
| Nanoindentation creep behavior of nanocomposite Sn-Ag-Cu solders A Roshanghias, AH Kokabi, Y Miyashita, Y Mutoh, I Ihara, RG Guan Fatt, ... Journal of electronic materials 41, 2057-2064, 2012 | 35 | 2012 |
| On the effects of thickness on adhesion of TiW diffusion barrier coatings in silicon integrated circuits A Roshanghias, G Khatibi, R Pelzer, J Steinbrenner Surface and Coatings Technology 259, 386-392, 2014 | 33 | 2014 |
| Ceria reinforced nanocomposite solder foils fabricated by accumulative roll bonding process A Roshanghias, AH Kokabi, Y Miyashita, Y Mutoh, M Rezayat, ... Journal of Materials Science: Materials in Electronics 23, 1698-1704, 2012 | 33 | 2012 |
| Evaluation of the sheet resistance of inkjet-printed Ag-layers on flexible, uncoated paper substrates using Van-der-Pauw’s method J Zikulnig, A Roshanghias, L Rauter, C Hirschl Sensors 20 (8), 2398, 2020 | 32 | 2020 |
| Nanocomposite SAC solders: morphology, electrical and mechanical properties of Sn–3.8 Ag–0.7 Cu solders by adding Co nanoparticles A Yakymovych, Y Plevachuk, P Švec, D Janičkovič, P Šebo, N Beronská, ... Journal of Materials Science: Materials in Electronics, 1-9, 2017 | 30 | 2017 |
| Disabling of nanoparticle effects at increased temperature in nanocomposite solders O Mokhtari, A Roshanghias, R Ashayer, HR Kotadia, F Khomamizadeh, ... Journal of electronic materials 41, 1907-1914, 2012 | 30 | 2012 |
| Synthesis and thermal behavior of tin-based alloy (Sn–Ag–Cu) nanoparticles A Roshanghias, A Yakymovych, J Bernardi, H Ipser Nanoscale 7 (13), 5843-5851, 2015 | 29 | 2015 |
| Printed electronics technologies for additive manufacturing of hybrid electronic sensor systems J Zikulnig, S Chang, J Bito, L Rauter, A Roshanghias, S Carrara, J Kosel Advanced Sensor Research 2 (7), 2200073, 2023 | 27 | 2023 |
| Enthalpy effect of adding cobalt to liquid Sn-3.8 Ag-0.7 Cu lead-free solder alloy: difference between bulk and nanosized cobalt A Yakymovych, G Kaptay, A Roshanghias, H Flandorfer, H Ipser The Journal of Physical Chemistry C 120 (3), 1881-1890, 2016 | 27 | 2016 |
| A comparative study on direct Cu–Cu bonding methodologies for copper pillar bumped flip-chips Y Ma, A Roshanghias, A Binder Journal of Materials Science: Materials in Electronics 29, 9347-9353, 2018 | 20 | 2018 |
| Self-propagating reactive Al/Ni nanocomposites for bonding applications MP Kremer, A Roshanghias, A Tortschanoff Micro and Nano Systems Letters 5, 1-5, 2017 | 20 | 2017 |