| Secure interposer-based heterogeneous integration MSM Khan, C Xi, AA Khan, MT Rahman, MM Tehranipoor, ... IEEE Design & Test 39 (6), 156-164, 2022 | 29 | 2022 |
| Exploring advanced packaging technologies for reverse engineering a system-in-package (sip) MSM Khan, C Xi, MSU Haque, MM Tehranipoor, N Asadizanjani IEEE Transactions on Components, Packaging and Manufacturing Technology 13 …, 2023 | 16 | 2023 |
| Us microelectronics packaging ecosystem: Challenges and opportunities R Noor, HR Kottur, PJ Craig, LK Biswas, MSM Khan, N Varshney, H Dalir, ... arXiv preprint arXiv:2310.11651, 2023 | 11 | 2023 |
| Non-invasive blood glucose measurement using near infra-red spectroscopy AT Priyoti, SJ Jim, S Hossain, S Mahmud, S Salvin, A Bhattacharjee 2019 IEEE R10 Humanitarian Technology Conference (R10-HTC)(47129), 1-4, 2019 | 11 | 2019 |
| Enhancing counterfeit detection of integrated circuits through machine learning-assisted THz-TDS analysis C Xi, N Varshney, MSM Khan, H Dalir, N Asadizanjani Terahertz, RF, Millimeter, and Submillimeter-Wave Technology and …, 2024 | 10 | 2024 |
| Thz-tds for ic packaging material changes detection under real-world conditions C Xi, N Varshney, MSM Khan, H Dalir, N Asadizanjani Terahertz, RF, Millimeter, and Submillimeter-Wave Technology and …, 2024 | 7 | 2024 |
| Emerging nonvolatile memories—an assessment of vulnerability to probing attacks LK Biswas, M Shafkat, M Khan, L Lavdas, N Asadizanjani International Symposium for Testing and Failure Analysis 84437, 217-224, 2022 | 7 | 2022 |
| : An X-Ray Compatibility Metric for Advanced Packages to Facilitate Design-for-Inspection MSM Khan, C Xi, N Varshney, AA Khan, A Serna, H Dalir, V Sorger, ... 2023 IEEE Physical Assurance and Inspection of Electronics (PAINE), 1-7, 2023 | 5 | 2023 |
| CAKE-SiP: Chiplet Authenticate & Key Exchange for Secure Provisioning in System-in-Package MSUI Sami, MSM Khan, F Farahmandi, N Asadizanjani, M Tehranipoor 2024 IEEE Physical Assurance and Inspection of Electronics (PAINE), 1-8, 2024 | 1 | 2024 |
| Toward Standardized Vulnerability Assessment of Advanced Packaging Against Probing Attacks MSM Khan, LK Biswas, HR Kottur, R Noor, N Varshney, N Hastings, ... IEEE Design & Test, 2025 | | 2025 |
| Mechanical Sample Preparation for Heterogeneous Integration (HI) Packaging C Xi, MSM Khan, N Varshney, AA Khan, C Richardson, N Asadizanjani 2024 IEEE Physical Assurance and Inspection of Electronics (PAINE), 1-8, 2024 | | 2024 |
| Fault-marking: defect-pattern leveraged inherent fingerprinting of advanced IC package with thermoreflectance imaging N Varshney, MSM Khan, S Ghosh, A Roy, JH Bahk, N Asadizanjani Infrared Sensors, Devices, and Applications XIV 13145, 76-82, 2024 | | 2024 |
| Assessing Compatibility of Advanced IC Packages to X-ray Based Physical Inspection M Shafkat, M Khan, C Xi, N Varshney, AA Khan, H Dalir, N Asadizanjani EDFA Technical Articles 26 (3), 14-24, 2024 | | 2024 |
| ASSESSING COMPATIBILITY OF ADVANCED IC PACKAGES TO X-RAY BASED PHYSICAL INSPECTION. M Khan, C Xi, N Varshney, AA Khan, H Dalir, N Asadizanjani Electronic Device Failure Analysis 26 (3), 2024 | | 2024 |
| Antenna-in-Package Assurance with Radio Frequency Fingerprint R Noor, LK Biswas, MSM Khan, YK Yoon, N Asadizanjani ISTFA 2023, 323-328, 2023 | | 2023 |
| SECURITY ASSESSMENT OF NONVOLATILE MEMORY AGAINST PHYSICAL PROBING LK Biswas, MSM Khan, L Lavdas, N Asadizanjani | | 2022 |
Chengjie XiUniversity of FloridaVerified email at ufl.edu
