| Capillary wicking in hierarchically textured copper nanowire arrays J Lee, Y Suh, PP Dubey, MT Barako, Y Won ACS applied materials & interfaces 11 (1), 1546-1554, 2018 | 68 | 2018 |
| A deep learning perspective on dropwise condensation Y Suh, J Lee, P Simadiris, X Yan, S Sett, L Li, KF Rabbi, N Miljkovic, ... Advanced Science 8 (22), 2101794, 2021 | 46 | 2021 |
| Boiling heat transfer with a well-ordered microporous architecture QN Pham, S Zhang, S Hao, K Montazeri, CH Lin, J Lee, A Mohraz, Y Won ACS applied materials & interfaces 12 (16), 19174-19183, 2020 | 44 | 2020 |
| Kinetic and mechanical properties of dual curable adhesives for display bonding process JG Lee, GS Shim, JW Park, HJ Kim, KY Han International Journal of Adhesion and Adhesives 70, 249-259, 2016 | 39 | 2016 |
| Fiber electrode by one-pot wet-spinning of graphene and manganese oxide nanowires for wearable lithium-ion batteries JG Lee, Y Kwon, JY Ju, S Choi, Y Kang, WR Yu, DW Kim Journal of Applied Electrochemistry 47, 865-875, 2017 | 28 | 2017 |
| Evaluation of UV curing properties of mixture systems with differently sized monomers JW Park, GS Shim, JG Lee, SW Jang, HJ Kim, JN Choi Materials 11 (4), 509, 2018 | 27 | 2018 |
| The design of hydrophilic nanochannel‐macrostripe fog collector: Enabling wicking‐assisted vertical liquid delivery for the enhancement in fog collection efficiency J Lee, J So, WG Bae, Y Won Advanced Materials Interfaces 7 (11), 1902150, 2020 | 26 | 2020 |
| Adhesive composition and display device Y Kim, H Kim, D No, J Park, S Moon, J Lee US Patent 9,773,997, 2017 | 12 | 2017 |
| Curing behavior and viscoelasticity of dual-curable adhesives based on high-reactivity azo initiator JG Lee, GS Shim, JW Park, HJ Kim, SE Moon, YK Kim, DH No, JH Kim, ... Journal of Electronic Materials 45, 3786-3794, 2016 | 12 | 2016 |
| Computer vision-assisted investigation of boiling heat transfer on segmented nanowires with vertical wettability J Lee, Y Suh, M Kuciej, P Simadiris, MT Barako, Y Won Nanoscale 14 (36), 13078-13089, 2022 | 11 | 2022 |
| Thermal improvement of HBM with joint thermal resistance reduction for scaling 12 stacks and beyond T Kim, J Lee, Y Kim, H Park, H Hwang, J Kim, H Jung, DW Kim 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 767-771, 2023 | 9 | 2023 |
| Thermal Modeling and Analysis of High Bandwidth Memory in 2.5 D Si-interposer Systems T Kim, J Lee, J Kim, EC Lee, H Hwang, Y Kim, DKS Oh 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | 9 | 2022 |
| Droplet jumping on superhydrophobic copper oxide nanostructured surfaces J Lee, B Shao, Y Won IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (6 …, 2018 | 9 | 2018 |
| Evaporative wicking phenomena on nanotextured surfaces DV Le, QN Pham, J Lee, S Zhang, Y Won Journal of Electronic Packaging 141 (3), 031013, 2019 | 8 | 2019 |
| Evaluation of the ultraviolet-curing kinetics of ultraviolet-polymerized oligomers cured using poly (ethylene glycol) dimethacrylate JW Park, JG Lee, GS Shim, HJ Kim, YK Kim, SE Moon, DH No Coatings 8 (3), 99, 2018 | 6 | 2018 |
| Enhancing Recurrent Droplet Jumping Phenomena on Heterogeneous Surface Designs J Lee, Y Won Advanced Materials Interfaces, 2022 | 3 | 2022 |
| Adhesive composition and display device Y Kim, H Kim, D No, J Park, S Moon, J Lee US Patent 9,868,878, 2018 | 3 | 2018 |
| Enhanced Capillary Wicking through Hierarchically Porous Constructs Derived from Bijel Templates J Lee, A Mohraz, Y Won Langmuir 38 (46), 14063-14072, 2022 | 2 | 2022 |
| Two-level copper oxide nanostructured surfaces for condensation heat transfer J Lee, B Shao, Y Won 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018 | 2 | 2018 |
Yoonjin WonAssociate Professor, University of California, IrvineVerified email at uci.edu