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James L BosseUniversity of ConnecticutVerified email at uconn.edu
R. RAMESHUniversity of California, BerkeleyVerified email at berkeley.edu
Yasemin KutesSr. Test R&D Engineer, Intel CorporationVerified email at intel.com
Linghan YeBruker Corp.Verified email at uconn.edu
Darrell G. SchlomCornell UniversityVerified email at cornell.edu
Oleg KolosovProfessor of Nanoscience, Physics Department, Lancaster University, UKVerified email at lancaster.ac.uk
Nitin P. PadtureOtis E. Randall University Professor, Brown UniversityVerified email at brown.edu
Jorge Íñiguez-GonzálezLuxembourg Institute of Science and Technology (LIST)Verified email at list.lu
Yuanyuan ZhouThe Hong Kong University of Science and Technology (HKUST)Verified email at ust.hk
Roger H. FrenchKyocera Professor, Case Western Reserve University, Case School of Engineering, Materials ScienceVerified email at case.edu
Varun VyasBennett University, IndiaVerified email at bennett.edu.in
Morgan TrassinProfessor at Materials Department ETH ZurichVerified email at mat.ethz.ch
Jeffrey R. McCutcheonUniversity of ConnecticutVerified email at engr.uconn.edu
Kristopher O. DavisUniversity of Central FloridaVerified email at ucf.edu
John HeronUniversity of MichiganVerified email at umich.edu
Justin LuriaSr. Electrical Engineer, RaytheonVerified email at raytheon.com
Jon IhlefeldUniversity of VirginiaVerified email at virginia.edu
Andrzej J KulikEPFL SwitzerlandVerified email at epfl.ch
Robert SzoszkiewiczUniversity of WarsawVerified email at chem.uw.edu.pl
John BlendellPurdue UniversityVerified email at purdue.edu