| Perceived colleagues’ safety knowledge/behavior and safety performance: Safety climate as a moderator in a multilevel study L Jiang, G Yu, Y Li, F Li Accident analysis & prevention 42 (5), 1468-1476, 2010 | 273 | 2010 |
| Accelerator-friendly neural-network training: Learning variations and defects in RRAM crossbar L Chen, J Li, Y Chen, Q Deng, J Shen, X Liang, L Jiang Design, Automation & Test in Europe Conference & Exhibition (DATE), 2017, 19-24, 2017 | 271 | 2017 |
| Test architecture design and optimization for three-dimensional SoCs L Jiang, L Huang, Q Xu 2009 Design, Automation & Test in Europe Conference & Exhibition, 220-225, 2009 | 122 | 2009 |
| On effective TSV repair for 3D-stacked ICs L Jiang, Q Xu, B Eklow 2012 Design, Automation & Test in Europe Conference & Exhibition (DATE), 793-798, 2012 | 121 | 2012 |
| Drq: dynamic region-based quantization for deep neural network acceleration Z Song, B Fu, F Wu, Z Jiang, L Jiang, N Jing, X Liang 2020 ACM/IEEE 47th Annual International Symposium on Computer Architecture …, 2020 | 105 | 2020 |
| Layout-driven test-architecture design and optimization for 3D SoCs under pre-bond test-pin-count constraint L Jiang, Q Xu, K Chakrabarty, TM Mak Proceedings of the 2009 International Conference on Computer-Aided Design …, 2009 | 92 | 2009 |
| System-level hardware failure prediction using deep learning X Sun, K Chakrabarty, R Huang, Y Chen, B Zhao, H Cao, Y Han, X Liang, ... Proceedings of the 56th Annual Design Automation Conference 2019, 1-6, 2019 | 91 | 2019 |
| Remediation of heavy metals contaminated saline soils: a halophyte choice? HL Wang, CY Tian, L Jiang, L Wang Environmental science & technology 48 (1), 21-22, 2014 | 89 | 2014 |
| On effective through-silicon via repair for 3-D-stacked ICs L Jiang, Q Xu, B Eklow IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2013 | 88 | 2013 |
| ReCom: An efficient resistive accelerator for compressed deep neural networks H Ji, L Song, L Jiang, H Li, Y Chen 2018 Design, Automation & Test in Europe Conference & Exhibition (DATE), 237-240, 2018 | 83 | 2018 |
| Yield enhancement for 3D-stacked memory by redundancy sharing across dies L Jiang, R Ye, Q Xu 2010 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 230-234, 2010 | 81 | 2010 |
| Automated rule-based constructability checking: Case study of formwork L Jiang, RM Leicht Journal of Management in Engineering 31 (1), A4014004, 2015 | 66 | 2015 |
| SSTDP: Supervised spike timing dependent plasticity for efficient spiking neural network training F Liu, W Zhao, Y Chen, Z Wang, T Yang, L Jiang Frontiers in Neuroscience 15, 756876, 2021 | 63 | 2021 |
| PIM-prune: Fine-grain DCNN pruning for crossbar-based process-in-memory architecture C Chu, Y Wang, Y Zhao, X Ma, S Ye, Y Hong, X Liang, Y Han, L Jiang 2020 57th ACM/IEEE Design Automation Conference (DAC), 1-6, 2020 | 63 | 2020 |
| An ultra-efficient memristor-based DNN framework with structured weight pruning and quantization using ADMM G Yuan, X Ma, C Ding, S Lin, T Zhang, ZS Jalali, Y Zhao, L Jiang, ... 2019 IEEE/ACM International Symposium on Low Power Electronics and Design …, 2019 | 56 | 2019 |
| On effective and efficient in-field TSV repair for stacked 3D ICs L Jiang, F Ye, Q Xu, K Chakrabarty, B Eklow Proceedings of the 50th Annual Design Automation Conference, 1-6, 2013 | 56 | 2013 |
| Reclamation of saline soil by planting annual euhalophyte Suaeda salsa with drip irrigation: A three-year field experiment in arid northwestern China L Wang, X Wang, L Jiang, K Zhang, M Tanveer, C Tian, Z Zhao Ecological Engineering 159, 106090, 2021 | 54 | 2021 |
| Spikeconverter: An efficient conversion framework zipping the gap between artificial neural networks and spiking neural networks F Liu, W Zhao, Y Chen, Z Wang, L Jiang Proceedings of the AAAI Conference on Artificial Intelligence 36 (2), 1692-1701, 2022 | 51 | 2022 |
| Improving neural network efficiency via post-training quantization with adaptive floating-point F Liu, W Zhao, Z He, Y Wang, Z Wang, C Dai, X Liang, L Jiang Proceedings of the IEEE/CVF international conference on computer vision …, 2021 | 51 | 2021 |
| Yield enhancement for 3D-stacked ICs: Recent advances and challenges Q Xu, L Jiang, H Li, B Eklow 17th Asia and South Pacific Design Automation Conference, 731-737, 2012 | 42 | 2012 |
Xiaoyao LiangShanghai Jiao Tong UniversityVerified email at eecs.harvard.edu