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Co-authors

Paul McCloskeyTyndall National InstituteVerified email at tyndall.ie
James RohanTyndall National Institute, University College Cork, IrelandVerified email at tyndall.ie
Cian O'MathunaTyndall National Institute & University College Cork & IrelandVerified email at Tyndall.ie

Daniel C. Smallwood

Daniel C. Smallwood

Tyndall National Institute

Verified email at tyndall.ie


Title Sort by citations Sort by year Sort by title	Cited by Cited by	Year
Methods for latent image simulations in photolithography with a polychromatic light attenuation equation for fabricating VIAs in 2.5 D and 3D advanced packaging architectures DC Smallwood, P McCloskey, C O’Mathuna, DP Casey, JF Rohan Microsystems & Nanoengineering 7 (1), 39, 2021	5	2021
Multiphysics design and fabrication of 3D electroplated VIA materials topographies for next generation energy and sensor technologies DC Smallwood, P McCloskey, JF Rohan Materials & Design 221, 111001, 2022	3	2022
Design, Modeling, and Analysis of a 3-D Spiral Inductor With Magnetic Thin-Films for PwrSoC/PwrSiP DC-DC Converters C Shetty, DC Smallwood IEEE Access 10, 92105-92127, 2022	2	2022
A vertical magnetic structure for integrated power conversion C O'mathuna, D Smallwood, Z Pavlovic, H Smiddy, S O'driscoll, ... US Patent App. 17/285,751, 2022		2022
Electrochemical materials for integrated magnetics DC Smallwood University College Cork, 2021		2021

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