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Qiang GUO
Qiang GUO
Nanjing University, National University of Singapore, Institute of Microelectronics, Chartered
Verified email at asmc.com.cn
Title
Cited by
Cited by
Year
Interface-induced strain hardening of graphene nanosheet/aluminum composites
Y Jiang, R Xu, Z Tan, G Ji, G Fan, Z Li, DB Xiong, Q Guo, Z Li, D Zhang
Carbon 146, 17-27, 2019
1392019
Test structures for on-chip real-time reliability testing
I Manna, LK Foo, G Qiang, Z Xu
US Patent 6,724,214, 2004
1082004
Enhanced load transfer by designing mechanical interfacial bonding in carbon nanotube reinforced aluminum composites
Z Yu, Z Tan, R Xu, G Ji, G Fan, DB Xiong, Q Guo, Z Li, D Zhang
Carbon 146, 155-161, 2019
882019
Enhanced corrosion resistance in metal matrix composites assembled from graphene encapsulated copper nanoflakes
B Jin, DB Xiong, Z Tan, G Fan, Q Guo, Y Su, Z Li, D Zhang
Carbon 142, 482-490, 2019
832019
Strengthening and deformation mechanisms in nanolaminated graphene-Al composite micro-pillars affected by graphene in-plane sizes
L Zhao, Q Guo, Z Li, DB Xiong, S Osovski, Y Su, D Zhang
International Journal of Plasticity 116, 265-279, 2019
792019
Investigation of electrical conduction in carbon-doped silicon oxide using a voltage ramp method
KY Yiang, WJ Yoo, Q Guo, A Krishnamoorthy
Applied physics letters 83 (3), 524-526, 2003
772003
Enhanced mechanical properties and high electrical conductivity in multiwalled carbon nanotubes reinforced copper matrix nanolaminated composites
J Liu, DB Xiong, Z Tan, G Fan, Q Guo, Y Su, Z Li, D Zhang
Materials Science and Engineering: A 729, 452-457, 2018
622018
Method to form Cu/OSG dual damascene structure for high performance and reliable interconnects
Q Guo, A Krishnamoorthy, X Bu, VN Bliznetsov
US Patent 6,913,994, 2005
362005
Correlating micro-pillar compression behavior with bulk mechanical properties: Nanolaminated graphene-Al composite as a case study
Y Hu, Q Guo, L Zhao, Z Li, G Fan, Z Li, DB Xiong, Y Su, D Zhang
Scripta Materialia 146, 236-240, 2018
272018
Via electromigration improvement by changing the via bottom geometric profile
B Zhang, CH Low, HL Lee, SY Loong, Q Guo
US Patent 7,045,455, 2006
202006
The role of point defects in anomalous diffusion of implanted boron in silicon
X Bao, Q Guo, M Hu, D Feng
Journal of applied physics 66 (3), 1475-1477, 1989
201989
Effect of thermal cycling on the mechanical properties of carbon nanotubes reinforced copper matrix nanolaminated composites
J Liu, DB Xiong, Y Su, Q Guo, Z Li, D Zhang
Materials Science and Engineering: A 739, 132-139, 2019
172019
Structural modeling and mechanical behavior of Metal-Porous-Polymer-Composites (MPPCs) with different polymer volume fractions
Y Su, Z Li, X Gong, Q Ouyang, Q Guo, C Guo, J Zhang, D Zhang
Composite Structures 153, 673-681, 2016
162016
Compositionally matched nitrogen-doped Ge2Sb2Te5/Ge2Sb2Te5 superlattice-like structures for phase change random access memory
CC Tan, L Shi, R Zhao, Q Guo, Y Li, Y Yang, TC Chong, JA Malen, ...
Applied Physics Letters 103, 133507, 2013
162013
Study of leakage mechanisms of the copper/Black Diamond™ damascene process
KY Yiang, Q Guo, WJ Yoo, A Krishnamoorthy
Thin Solid Films 462, 330-333, 2004
142004
Implantation damage and anomalous diffusion of implanted boron in silicon
Q Guo, X Bao, J Hong, Y Yan, D Feng
Applied Physics Letters 54 (15), 1433-1435, 1989
131989
Physical understanding of hot carrier injection variability in deeply scaled nMOSFETs
L Ma, X Ji, Z Chen, Y Liao, F Yan, Y Song, Q Guo
Japanese Journal of Applied Physics 53 (4S), 04EC15, 2014
112014
The energy distribution of NBTI-induced hole traps in the Si band gap in PNO pMOSFETs
X Ji, Y Liao, F Yan, Y Shi, G Zhang, Q Guo
2012 IEEE International Reliability Physics Symposium (IRPS), XT. 12.1-XT. 12.5, 2012
112012
Polymer residue chemical composition analysis and its effect on via contact resistance in dual damascene copper interconnects process integration
YS Zheng, Q Guo, YJ Su, PD Foo
Microelectronics journal 34 (2), 109-113, 2003
112003
2 Dimensional finite stochastic breakup model of biomass particle breakup
Q Guo, H Liu, X Chen
Bioresource technology 129, 12-17, 2013
92013
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