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Co-authors
E. Todd RyanIntel CorporationVerified email at intel.com
Ishwara BhatProfessor, Electrical Computer Systems EngineeringVerified email at rpi.edu
RUILONG XIEIBMVerified email at ibm.com
Vimal KamineniGLOBALFOUNDRIES, College of Nanoscale Science and Engineering, Louisiana Tech UniversityVerified email at globalfoundries.com
Kuan-Chih (Jacky) HuangRensselaer Polytechnic InstituteVerified email at intel.com
Ajey JacobInformation Sciences Institute, University of Southern CaliforniaVerified email at isi.edu
Kerem AkarvardarTSMCVerified email at tsmc.com
Gwo-Ching WangRensselaer Polytechnic InstituteVerified email at rpi.edu
Toh-Ming LuRensselaer Polytechnic InstituteVerified email at rpi.edu
Thomas C ParkerUS Army Research LabVerified email at army.mil
Kunaljeet TanwarVerified email at mckinsey.com
Jinping LiuIntelVerified email at intel.com
Bipul PaulGlobalfoundriesVerified email at globalfoundries.com
Michael RizzoloIBMVerified email at us.ibm.com
Prasad BhosaleSenior Process Technologist/Integration, Applied MaterialsVerified email at uw.edu
Sunil Kumar SinghSamsung, HFC, GlobalFoundries, TSMC, Indian Institute of Technology Bombay, Indian Institute ofVerified email at samsung.com
Jason Eugene StephensIntel, Apple, GlobalFoundries, IBM, University of Oregon, Southern Oregon UniversityVerified email at intel.com
R. GaireApplied Materials, Albany, NYVerified email at amat.com
Ravi Prakash SrivastavaSenior Member of Technical Staff, Master InventorVerified email at globalfoundries.com
Lei SunGlobalfoundries, University of Rochester, Nankai UniversityVerified email at globalfoundries.com
Follow
Nicholas LiCausi
PsiQuantum, GLOBALFOUNDRIES, Rensselaer Polytechnic Institute
Verified email at psiquantum.com