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Co-authors
Dan KilperTrinity College DublinVerified email at tcd.ie
Yonggang WenFIEEE, FSAEng, Professor & President's Chair, Nanyang Technological University SingaporeVerified email at ntu.edu.sg
Antonia Maria TulinoUniverisità Federico II, Napoli, Italy - New York University, NY USA, - Bell Labs, NJ, USAVerified email at unina.it
Emina SoljaninRutgers UniversityVerified email at rutgers.edu
Weiwen ZhangGuangdong University of TechnologyVerified email at gdut.edu.cn
Jaime LlorcaNew York University - University of Naples Federico IIVerified email at nyu.edu
Haiyun LuoGoogleVerified email at google.com
Dapeng Oliver WuCity University of Hong KongVerified email at cityu.edu.hk
Nakjung ChoiBell LabsVerified email at nokia-bell-labs.com
Bipin Sankar Gopalakrishna PillaiAnalytics and Data Science LeadVerified email at verifier.me
Rodney S TuckerUniversity of MelbourneVerified email at unimelb.edu.au
Yichao JinNanyang Technological UniversityVerified email at ntu.edu.sg
William ShiehProfessor, Westlake University, China / Honorary Professor, The University of Melbourne, AustraliaVerified email at westlake.edu.cn
Behnam SedighiSemiconductor IndustryVerified email at qti.qualcomm.com
Sethumadhavan ChandrasekharRetired Nokia Bell LabsVerified email at ieee.org
Matteo VarvelloResearcher at Bell LabsVerified email at nokia.com
Srikanta KumarVerified email at ieee.org
Ece GulsenMITVerified email at alum.mit.edu
Jesse E. SimsarianBell Labs, NokiaVerified email at nokia.com
CHEN SONGHuawei US R&DVerified email at huawei.com