| Recent advances in EM and BTI induced reliability modeling, analysis and optimization SXD Tan, H Amrouch, T Kim, Z Sun, C Cook, J Henkel Integration 60, 132-152, 2018 | 56 | 2018 |
| Fast electromigration stress evolution analysis for interconnect trees using Krylov subspace method C Cook, Z Sun, E Demircan, MD Shroff, SXD Tan IEEE Transactions on Very Large Scale Integration (VLSI) Systems 26 (5), 969-980, 2018 | 50 | 2018 |
| Fast electromigration immortality analysis for multisegment copper interconnect wires Z Sun, E Demircan, MD Shroff, C Cook, SXD Tan IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2018 | 43 | 2018 |
| Voltage-based electromigration immortality check for general multi-branch interconnects Z Sun, E Demircan, MD Shroff, T Kim, X Huang, SXD Tan 2016 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 1-7, 2016 | 39 | 2016 |
| VLSI Systems Long-Term Reliability–Modeling, Simulation and Optimization SXD Tan, M Tahoori, T Kim, S Wang, Z Sun, S Kiamehr Cham, Switzerland: Springer, 2019 | 37 | 2019 |
| EMSpice: Physics-based electromigration check using coupled electronic and stress simulation Z Sun, S Yu, H Zhou, Y Liu, SXD Tan IEEE Transactions on Device and Materials Reliability 20 (2), 376-389, 2020 | 35 | 2020 |
| Fast analytic electromigration analysis for general multisegment interconnect wires L Chen, SXD Tan, Z Sun, S Peng, M Tang, J Mao IEEE Transactions on Very Large Scale Integration (VLSI) Systems 28 (2), 421-432, 2019 | 28 | 2019 |
| Energy and lifetime optimizations for dark silicon manycore microprocessor considering both hard and soft errors T Kim, Z Sun, HB Chen, H Wang, SXD Tan IEEE Transactions on Very Large Scale Integration (VLSI) Systems 25 (9 …, 2017 | 28 | 2017 |
| Long-term reliability of nanometer VLSI systems S Tan, M Tahoori, T Kim, S Wang, Z Sun, S Kiamehr Cham: Springer, 2019 | 26 | 2019 |
| A fast semi-analytic approach for combined electromigration and thermomigration analysis for general multisegment interconnects L Chen, SXD Tan, Z Sun, S Peng, M Tang, J Mao IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2020 | 25 | 2020 |
| Finite difference method for electromigration analysis of multi-branch interconnects C Cook, Z Sun, T Kim, SXD Tan 2016 13th International Conference on Synthesis, Modeling, Analysis and …, 2016 | 24 | 2016 |
| Em-gan: Data-driven fast stress analysis for multi-segment interconnects W Jin, S Sadiqbatcha, Z Sun, H Zhou, SXD Tan 2020 IEEE 38th International Conference on Computer Design (ICCD), 296-303, 2020 | 22 | 2020 |
| Accelerating electromigration aging for fast failure detection for nanometer ICs Z Sun, S Sadiqbatcha, H Zhao, SXD Tan 2018 23rd Asia and South Pacific Design Automation Conference (ASP-DAC), 623-630, 2018 | 21 | 2018 |
| Leveraging recovery effect to reduce electromigration degradation in power/ground TSV S Wang, Z Sun, Y Cheng, SXD Tan, MB Tahoori 2017 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 811-818, 2017 | 19 | 2017 |
| Electromigration-lifetime constrained power grid optimization considering multi-segment interconnect wires H Zhou, Y Sun, Z Sun, H Zhao, SXD Tan 2018 23rd Asia and South Pacific Design Automation Conference (ASP-DAC), 399-404, 2018 | 16 | 2018 |
| Accelerating electromigration aging: Fast failure detection for nanometer ICs S Sadiqbatcha, Z Sun, SXD Tan IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2019 | 15 | 2019 |
| EM-aware and lifetime-constrained optimization for multisegment power grid networks H Zhou, Z Sun, S Sadiqbatcha, N Chang, SXD Tan IEEE Transactions on Very Large Scale Integration (VLSI) Systems 27 (4), 940-953, 2019 | 13 | 2019 |
| Reliability based hardware Trojan design using physics-based electromigration models C Cook, S Sadiqbatcha, Z Sun, SXD Tan Integration 66, 9-15, 2019 | 11 | 2019 |
| Recovery-aware proactive TSV repair for electromigration lifetime enhancement in 3-D ICs S Wang, T Kim, Z Sun, SXD Tan, MB Tahoori IEEE Transactions on Very Large Scale Integration (VLSI) Systems 26 (3), 531-543, 2017 | 11 | 2017 |
| Dynamic reliability management for near-threshold dark silicon processors T Kim, Z Sun, C Cook, J Gaddipati, H Wang, H Chen, SXD Tan 2016 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 1-7, 2016 | 11 | 2016 |