| iPROBE: internal shielding approach for protecting against front-side and back-side probing attacks M Gao, MS Rahman, N Varshney, M Tehranipoor, D Forte IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2023 | 13 | 2023 |
| He-ion Beam Imaging for Accurate Hardware Trojan Detection NA Nitin Varshney, Haoting Shen, Olivia Paradis Microscopy and Microanalysis, 1-3, 2020 | 12* | 2020 |
| Us microelectronics packaging ecosystem: Challenges and opportunities R Noor, HR Kottur, PJ Craig, LK Biswas, MSM Khan, N Varshney, H Dalir, ... arXiv preprint arXiv:2310.11651, 2023 | 11 | 2023 |
| Hardware deprocessing using voltage imaging for hardware assurance MM Tehranipoor, N Asadi-Zanjani, OP Paradis, N Varshney US Patent 11,604,912, 2023 | 11 | 2023 |
| Enhancing counterfeit detection of integrated circuits through machine learning-assisted THz-TDS analysis C Xi, N Varshney, MSM Khan, H Dalir, N Asadizanjani Terahertz, RF, Millimeter, and Submillimeter-Wave Technology and …, 2024 | 10 | 2024 |
| Proof of reverse engineering barrier: sem image analysis on covert gates T Farheen, U Botero, N Varshney, DL Woodard, M Tehranipoor, D Forte, ... International Symposium for Testing and Failure Analysis 84215, 179-189, 2021 | 10 | 2021 |
| An end-to-end bitstream tamper attack against flip-chip FPGAs F Rahman, F Farahmandi, M Tehranipoor Cryptology ePrint Archive, 2021 | 7 | 2021 |
| THz-TDS for IC packaging material changes detection under real-world conditions C Xi, N Varshney, MSM Khan, H Dalir, N Asadizanjani Terahertz, RF, Millimeter, and Submillimeter-Wave Technology and …, 2024 | 6 | 2024 |
| Exploring the Effect of Annotation Quality on PCB Component Segmentation MMA Hasan, N Jessurun, N Varshney, N Asadizanjani International Symposium for Testing and Failure Analysis 84741, 136-144, 2023 | 6 | 2023 |
| LLE: mitigating IC piracy and reverse engineering by last level edit S Rahman, N Varshney, F Farahmandi, N Asadi Zanjani, M Tehranipoor International Symposium for Testing and Failure Analysis 84741, 360-369, 2023 | 6 | 2023 |
| From Talent Shortage to Workforce Excellence in the CHIPS Act Era: Harnessing Industry 4.0 Paradigms for a Sustainable Future in Domestic Chip Production AD Rizi, A Roy, R Noor, H Kang, N Varshney, K Jacob, S Rivera-Jimenez, ... arXiv preprint arXiv:2308.00215, 2023 | 5 | 2023 |
| Demystifying edge cases in advanced ic packaging inspection through novel explainable ai metrics S Ghosh, A Roy, MM Al Hasan, P Craig, N Varshney, SJ Koppal, ... 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 2286-2293, 2024 | 4 | 2024 |
| : An X-Ray Compatibility Metric for Advanced Packages to Facilitate Design-for-Inspection MSM Khan, C Xi, N Varshney, AA Khan, A Serna, H Dalir, V Sorger, ... 2023 IEEE Physical Assurance and Inspection of Electronics (PAINE), 1-7, 2023 | 4 | 2023 |
| INSPECT: Investigating Supply Chain and Cyber-Physical Security of Battery Systems T Zhang, S Shi, MH Rahman, N Varshney, A Kulkarni, F Farahmandi, ... Cryptology ePrint Archive, 2024 | 3 | 2024 |
| Electron beam probing: The new sheriff in town for security analyzing of sub-7nm ics-exploring the advantages of a post-photon emission technique N Varshney, C Xi, AA Khan, LK Biswas, V Sorger, H Dalir, N Asadizanjani International Symposium for Testing and Failure Analysis 84741, 346-351, 2023 | 3 | 2023 |
| Security Challenges for Assurance in Silicon Photonic Packaging LK Biswas, AA Aslam, YK Yoon, N Asadizanjani, N Varshney, V Sorger, ... 2023 IEEE Research and Applications of Photonics in Defense Conference (RAPID), 2023 | 3 | 2023 |
| DeepICLogo: A Novel Benchmark Dataset for Deep Learning-Based IC Logo Detection S Ghosh, P Craig, J Julia, N Varshney, H Dalir, N Asadizanjani 2023 IEEE Physical Assurance and Inspection of Electronics (PAINE), 2023 | 2 | 2023 |
| Exploring physics-informed machine learning for system matrix formulation in x-ray imaging forward models S Ghosh, N Varshney, MM Al Hasan, A Roy, P Craig, SJ Koppal, H Dalir, ... Developments in X-Ray Tomography XV 13152, 72-79, 2024 | 1 | 2024 |
| Multi-modal printed circuit board netlist extraction with x-ray and optical imaging P Craig, N Varshney, A Roy, S Ghosh, C Patil, H Dalir, N Asadizanjani Developments in X-Ray Tomography XV 13152, 131520Q, 2024 | 1 | 2024 |
| Motivating automated multimodal failure analysis for heterogeneously integrated devices P Craig, N Varshney, A Roy, C Woychik, H Dalir, N Asadizanjani Developments in X-Ray Tomography XV 13152, 1315228, 2024 | 1 | 2024 |
Hamed DalirAssociate Professor in ECE, University of FloridaVerified email at ufl.edu
