Articles with public access mandates - Zhiming ChenLearn more
Not available anywhere: 44
Unified coprime array with multi-period subarrays for direction-of-arrival estimation
W Wang, S Ren, Z Chen
Digital Signal Processing 74, 30-42, 2018
Mandates: National Natural Science Foundation of China
A truly balanced Q-band CMOS frequency doubler based on hybrid quadrature coupler
J Wan, Z Chen, Q An, X Wang
IEEE microwave and wireless components letters 27 (2), 165-167, 2017
Mandates: National Natural Science Foundation of China
A highly linear low noise amplifier with wide range derivative superposition method
W Gao, Z Chen, Z Liu, W Cui, X Gui
IEEE Microwave and Wireless Components Letters 25 (12), 817-819, 2015
Mandates: National Natural Science Foundation of China
Electrical characterization of coaxial silicon–insulator–silicon through-silicon vias: Theoretical analysis and experiments
Z Chen, M Xiong, B Li, Y Yan, Y Ding
IEEE Transactions on Electron Devices 63 (12), 4880-4887, 2016
Mandates: National Natural Science Foundation of China
Wideband capacitance evaluation of silicon–insulator–silicon through-silicon-vias for 3D integration applications
X Wang, M Xiong, Z Chen, B Li, Y Yan, Y Ding
IEEE Electron Device Letters 37 (2), 216-219, 2015
Mandates: National Natural Science Foundation of China
Analysis of nonlinearities in injection-locked frequency dividers
X Gui, Z Chen, MM Green
IEEE Transactions on Microwave Theory and Techniques 63 (3), 945-953, 2015
Mandates: National Natural Science Foundation of China
Flexible broadband photodetectors enabled by MXene/PbS quantum dots hybrid structure
Y Sun, Z Liu, Y Ding, Z Chen
IEEE Electron Device Letters 42 (12), 1814-1817, 2021
Mandates: National Natural Science Foundation of China
Comparative evaluations on scallop-induced electric-thermo-mechanical reliability of through-silicon-vias
Z Cheng, Y Ding, L Xiao, X Wang, Z Chen
Microelectronics Reliability 103, 113512, 2019
Mandates: National Natural Science Foundation of China
Innovative polyimide liner deposition method for high-aspect-ratio and high-density through-silicon-vias (TSVs)
Y Ding, M Xiong, Y Yan, S Wang, Q Chen, W Wang, Z Chen
Microelectronic Engineering 149, 78-84, 2016
Mandates: National Natural Science Foundation of China
Enabling continuous Cu seed layer for deep through-silicon-vias with high aspect ratio by sequential sputtering and electroless plating
Z Zhang, Y Ding, L Xiao, Z Cai, B Yang, Z Chen, H Xie
IEEE Electron Device Letters 42 (10), 1520-1523, 2021
Mandates: National Natural Science Foundation of China
A -Band CMOS Amplifier With Temperature Compensation for Gain Variation Reduction
Q Qi, Z Chen
IEEE Microwave and Wireless Components Letters 28 (2), 150-152, 2018
Mandates: National Natural Science Foundation of China
Deep-reinforcement-learning-based NOMA-aided slotted ALOHA for LEO satellite IoT networks
H Yu, H Zhao, Z Fei, J Wang, Z Chen, Y Gong
IEEE Internet of Things Journal 10 (20), 17772-17784, 2023
Mandates: National Natural Science Foundation of China
A wide tuning range dual-core quad-mode orthogonal-coupled VCO with concurrently dual-output using parallel 8-shaped resonator
S Sun, W Deng, H Jia, R Wu, C Li, Z Wang, Z Chen, B Chi
IEEE Transactions on Microwave Theory and Techniques 71 (5), 2040-2054, 2022
Mandates: Chinese Academy of Sciences, National Natural Science Foundation of China
Development of eccentric spin coating of polymer liner for low-temperature TSV technology with ultra-fine diameter
M Xiong, Z Chen, Y Ding, H Kino, T Fukushima, T Tanaka
IEEE Electron Device Letters 40 (1), 95-98, 2018
Mandates: National Natural Science Foundation of China
Elimination of scallop-induced stress fluctuation on through-silicon-vias (TSVs) by employing polyimide liner
C Xue, Z Cheng, Z Chen, Y Yan, Z Cai, Y Ding
IEEE transactions on device and materials reliability 18 (2), 266-272, 2018
Mandates: National Natural Science Foundation of China
Low capacitance and highly reliable blind through-silicon-vias (TSVs) with vacuum-assisted spin coating of polyimide dielectric liners
YY Yan, M Xiong, B Liu, YT Ding, ZM Chen
Science China Technological Sciences 59, 1581-1590, 2016
Mandates: National Natural Science Foundation of China
A CML ring oscillator-based supply-insensitive PLL with on-chip calibrations
X Gui, P Gao, Z Chen
IEEE Transactions on Microwave Theory and Techniques 63 (1), 233-243, 2014
Mandates: National Natural Science Foundation of China
Investigation of dynamic thermal behaviors of an electrothermal micromirror
L Zhou, Z Chen, J Cheng, Q Chen, Y Ding, H Xie
Sensors and Actuators A: Physical 263, 269-275, 2017
Mandates: US National Science Foundation, National Natural Science Foundation of China
Integrating surface and interface engineering to improve optoelectronic performance and environmental stability of MXene-based heterojunction towards broadband photodetection
Z Liu, M Li, Y Sun, H Wang, H Chen, Y Tian, H Wang, Y Ding, Z Chen
Nano Research 16 (7), 10148-10155, 2023
Mandates: National Natural Science Foundation of China
Modeling and characterization of annealing-induced Cu protrusion of TSVs with polyimide liner considering diffusion creep behavior
B Yang, Y Ding, Z Cheng, A Ren, L Xiao, Y Yan, Z Zhang, Z Chen
IEEE Transactions on Electron Devices 70 (2), 695-701, 2022
Mandates: National Natural Science Foundation of China
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