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Massimo V FischettiThe University of Texas at DallasVerified email at utdallas.edu
Sung-Min HongSchool of EECS, Gwangju Institute of Science and TechnologyVerified email at gist.ac.kr
CHANG-KI BAEKPohang University of Science and Technology (POSTECH)Verified email at postech.ac.kr
Terrance O'ReganElectrical Engineer, DEVCOM Army Research LaboratoryVerified email at mail.mil
Nobuyuki SanoUniversity of TsukubaVerified email at esys.tsukuba.ac.jp
Changwook JeongAssociate Professor, Graduate School of Semicondutor Materials and Devices Engineering, UNISTVerified email at unist.ac.kr
Mark J.W. RodwellProfessor of Electrical and Computer Engineering, University of California, Santa BarbaraVerified email at ece.ucsb.edu
Zhengping JiangSamsung Semiconductor Inc.Verified email at samsung.com
Jiseok KimBroadcom Ltd.Verified email at broadcom.com
Yan ZhangIBMVerified email at us.ibm.com
Krishna K. BhuwalkaBelgium Research Center, HuaweiVerified email at huawei.com
Jing WangNVIDIA CorporationVerified email at nvidia.com
Yang LuSamsung SemiconductorVerified email at samsung.com
Siddhartha DharInstitute for Microelectronics, TU Wien, AustriaVerified email at iue.tuwien.ac.at
Bart SoreePrincipal scientist @ imec and part-time professor University Antwerp & KULeuvenVerified email at imec.be
Marc Meurisimec / imomecVerified email at imec.be
Mirco CantoroSamsung ElectronicsVerified email at samsung.com
Mathieu LuisierETH ZurichVerified email at iis.ee.ethz.ch
Nuo XuTSMC; Samsung; IMEC; Synopsys; UC BerkeleyVerified email at eecs.berkeley.edu
kwangseok leeSamsung ElectronicsVerified email at samsung.com