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Co-authors
- Hongsheng LiuPostdoc in University of Milan BicoccaVerified email at unimib.it
- Yingchun ChengNanjing Tech University; University of Illinois Chicago; KAUST; Nanjing UniversityVerified email at njtech.edu.cn
- Junfeng ZhangShanxi Normal UniversityVerified email at sxnu.edu.cn
- Kai ChengXian University of Post and TelecommunicationsVerified email at xupt.edu.cn
- Yugui YaoBeijing Institute of TechnologyVerified email at bit.edu.cn
- Kehui WuTsientang Inst. Adv. Stu., Hangzhou, China /Previous: Inst. Phys. CASVerified email at iphy.ac.cn
- Cheng-Cheng Liu (刘铖铖)Beijing institute of technologyVerified email at bit.edu.cn
- Zhi-Ming Yu (余智明)Beijing Institute of TechnologyVerified email at bit.edu.cn
- Ruge QuhePeking UniversityVerified email at pku.edu.cn
- Yu GuoDalian university of technologyVerified email at dlut.edu.cn
- Xue Jiang (蒋雪)South China Normal University/Dalian University of TechnologyVerified email at dlut.edu.cn
- Junfeng Gao(高峻峰)Dalian University of TechnologyVerified email at dlut.edu.cn
- SB Zhang (Shengbai Zhang)Rensselaer Polytechnic InstituteVerified email at rpi.edu
- Damien WestResearch Scientist, Rensselaer Polytechnic InstituteVerified email at rpi.edu