Follow
Zhaowei Dai
Zhaowei Dai
Department of Electrical Engineering, Yale University
Verified email at yale.edu
Title
Cited by
Cited by
Year
Fabrication of ordered macro‐microporous single‐crystalline MOF and its derivative carbon material for supercapacitor
Q Li, Z Dai, J Wu, W Liu, T Di, R Jiang, X Zheng, W Wang, X Ji, P Li, Z Xu, ...
Advanced Energy Materials 10 (33), 1903750, 2020
1832020
Photonic chip-based low-noise microwave oscillator
I Kudelin, W Groman, QX Ji, J Guo, ML Kelleher, D Lee, T Nakamura, ...
Nature 627 (8004), 534-539, 2024
872024
Highly phosphatized magnetic catalyst with electron transfer induced by quaternary synergy for efficient dehydrogenation of ammonia borane
W Wang, Z Dai, R Jiang, Q Li, X Zheng, W Liu, Z Luo, Z Xu, J Peng
ACS Applied Materials & Interfaces 12 (39), 43854-43863, 2020
282020
A novel approach to interface high-Q Fabry–Pérot resonators with photonic circuits
H Cheng, N Jin, Z Dai, C Xiang, J Guo, Y Zhou, SA Diddams, F Quinlan, ...
APL Photonics 8 (11), 2023
132023
Large-scale pattern transfer based on non-through-hole AAO self-supporting membranes
X Zheng, R Jiang, X Qu, Q Li, F Zeng, W Wang, Z Dai, Z Xu, J Peng, Z Xu
Nanotechnology 31 (19), 195301, 2020
112020
Integrated Photonic Platform for Low Noise Microwave Generation
I Kudelin, W Groman, QX Ji, J Guo, M Kelleher, D Lee, T Nakamura, ...
CLEO: Science and Innovations, STh3M. 3, 2024
2024
Co-packaged micro reference cavity with photonic integrated circuits
H Cheng, N Jin, Z Dai, C Xiang, J Guo, Y Zhou, SA Diddams, F Quinlan, ...
2024 Optical Fiber Communications Conference and Exhibition (OFC), 1-3, 2024
2024
Fundamental limits to large-area plasmonic field enhancements
Z Dai, OD Miller
Plasmonics: Design, Materials, Fabrication, Characterization, and …, 2023
2023
On-Chip Poor Man’s Isolator
H Cheng, Z Dai, Y Zhou, F Ruesink, N Jin, D Mason, O Miller, P Rakich
Frontiers in Optics, FM5D. 1, 2022
2022
The system can't perform the operation now. Try again later.
Articles 1–9