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Wolfgang Pilz
Wolfgang Pilz
Privatly University
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Cited by
Year
Microfabrication of complex surface topographies using grey-tone lithography
B Wagner, HJ Quenzer, W Henke, W Hoppe, W Pilz
Sensors and Actuators A: Physical 46 (1-3), 89-94, 1995
1071995
One-level gray-tone design—Mask data preparation and pattern transfer
K Reimer, W Henke, HJ Quenzer, W Pilz, B Wagner
Microelectronic Engineering 30 (1-4), 559-562, 1996
381996
Impact of Si DRIE on vibratory MEMS gyroscope performance
P Merz, W Pilz, F Senger, K Reimer, M Grouchko, T Pandhumsoporn, ...
TRANSDUCERS 2007-2007 International Solid-State Sensors, Actuators and …, 2007
352007
Fabrication of microrelief surfaces using a one-step lithography process
K Reimer, U Hofmann, M Jürss, W Pilz, HJ Quenzer, B Wagner
Microelectronic Structures and MEMS for Optical Processing III 3226, 2-10, 1997
311997
MAGIC: a European program to push the insertion of maskless lithography
L Pain, B Icard, S Tedesco, B Kampherbeek, G Gross, C Klein, ...
Emerging Lithographic Technologies XII 6921, 535-546, 2008
272008
Projection maskless lithography (PML2): proof-of-concept setup and first experimental results
C Klein, E Platzgummer, H Loeschner, G Gross, P Dolezel, M Tmej, ...
Emerging Lithographic Technologies XII 6921, 509-516, 2008
222008
Micro-optical elements fabricated by electron-beam lithography and dry etching technique using top conductive coatings
R Steingrüber, M Ferstl, W Pilz
Microelectronic engineering 57, 285-289, 2001
202001
Oxygen reactive ion etching of polymers: profile evolution and process mechanisms
W Pilz, J Janes, KP Muller, J Pelka
Advanced Techniques for Integrated Circuit Processing 1392, 84-94, 1991
181991
PML2: The maskless multibeam solution for the 22nm node and beyond
C Klein, E Platzgummer, J Klikovits, W Piller, H Loeschner, T Bejdak, ...
Alternative Lithographic Technologies 7271, 186-197, 2009
172009
Crirical dimension control in X-ray masks with electroplated gold absorbers
W Windbracke, H Betz, HL Huber, W Pilz, S Pongratz
Microelectronic Engineering 5 (1-4), 73-80, 1986
171986
Effect of ion angular distributions on microloading in oxygen reactive‐ion etching of submicrometer polymer trenches
J Janes, W Pilz
Journal of applied physics 74 (1), 649-658, 1993
161993
Charged particle multi-beam lithography evaluations for sub-16nm hp mask node fabrication and wafer direct write
E Platzgummer, C Klein, P Joechl, H Loeschner, M Witt, W Pilz, ...
Photomask Technology 2009 7488, 381-392, 2009
152009
Characterization of CMOS programmable multi-beam blanking arrays as used for programmable multi-beam projection lithography and resistless nanopatterning
SE Kapl, H Loeschner, W Piller, M Witt, W Pilz, F Letzkus, M Jurisch, ...
Journal of Micromechanics and Microengineering 21 (4), 045038, 2011
142011
Discussion in profile phenomena in sub-μm resist reactive ion etching
W Pilz, H Hübner, F Heinrich, P Hoffmann, M Franosch
Microelectronic Engineering 9 (1-4), 491-494, 1989
141989
Submicron patterns formed by reactive ion etching
W Pilz, T Sponholz, S Pongratz, H Mader
Microelectronic Engineering 3 (1-4), 467-473, 1985
131985
SIMS and AES investigations of contamination effects by RIE of PIQ layers
IW Rangelow, K Maβeli, L Niewöhner, R Kassing, W Pilz
Microelectronic Engineering 3 (1-4), 475-481, 1985
111985
Fabrication of relief-topographic surfaces with a one-step UV-lithographic process
HJ Quenzer, W Henke, W Hoppe, W Pilz, K Reimer, B Wagner
Microsystem technologies 1, 196-201, 1995
101995
Profile evolution in the multi-level technique
W Pilz, J Pelka, P Banks
Microelectronic engineering 11 (1-4), 521-525, 1990
71990
In-situ diagnostics for plasma processing
P Banks, W Pilz, I Hussla, G Lorenz, G Castrischer
Monitoring and Control of Plasma-Enhanced Processing of Semiconductors 1037 …, 1989
61989
How to etch the optimal silicon trench: Profile development and process discussion
W Pilz, K Grändorff, J Janes, J Pelka
Dry Etch Technology 1593, 178-185, 1992
11992
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