Microfabrication of complex surface topographies using grey-tone lithography B Wagner, HJ Quenzer, W Henke, W Hoppe, W Pilz Sensors and Actuators A: Physical 46 (1-3), 89-94, 1995 | 107 | 1995 |
One-level gray-tone design—Mask data preparation and pattern transfer K Reimer, W Henke, HJ Quenzer, W Pilz, B Wagner Microelectronic Engineering 30 (1-4), 559-562, 1996 | 38 | 1996 |
Impact of Si DRIE on vibratory MEMS gyroscope performance P Merz, W Pilz, F Senger, K Reimer, M Grouchko, T Pandhumsoporn, ... TRANSDUCERS 2007-2007 International Solid-State Sensors, Actuators and …, 2007 | 35 | 2007 |
Fabrication of microrelief surfaces using a one-step lithography process K Reimer, U Hofmann, M Jürss, W Pilz, HJ Quenzer, B Wagner Microelectronic Structures and MEMS for Optical Processing III 3226, 2-10, 1997 | 31 | 1997 |
MAGIC: a European program to push the insertion of maskless lithography L Pain, B Icard, S Tedesco, B Kampherbeek, G Gross, C Klein, ... Emerging Lithographic Technologies XII 6921, 535-546, 2008 | 27 | 2008 |
Projection maskless lithography (PML2): proof-of-concept setup and first experimental results C Klein, E Platzgummer, H Loeschner, G Gross, P Dolezel, M Tmej, ... Emerging Lithographic Technologies XII 6921, 509-516, 2008 | 22 | 2008 |
Micro-optical elements fabricated by electron-beam lithography and dry etching technique using top conductive coatings R Steingrüber, M Ferstl, W Pilz Microelectronic engineering 57, 285-289, 2001 | 20 | 2001 |
Oxygen reactive ion etching of polymers: profile evolution and process mechanisms W Pilz, J Janes, KP Muller, J Pelka Advanced Techniques for Integrated Circuit Processing 1392, 84-94, 1991 | 18 | 1991 |
PML2: The maskless multibeam solution for the 22nm node and beyond C Klein, E Platzgummer, J Klikovits, W Piller, H Loeschner, T Bejdak, ... Alternative Lithographic Technologies 7271, 186-197, 2009 | 17 | 2009 |
Crirical dimension control in X-ray masks with electroplated gold absorbers W Windbracke, H Betz, HL Huber, W Pilz, S Pongratz Microelectronic Engineering 5 (1-4), 73-80, 1986 | 17 | 1986 |
Effect of ion angular distributions on microloading in oxygen reactive‐ion etching of submicrometer polymer trenches J Janes, W Pilz Journal of applied physics 74 (1), 649-658, 1993 | 16 | 1993 |
Charged particle multi-beam lithography evaluations for sub-16nm hp mask node fabrication and wafer direct write E Platzgummer, C Klein, P Joechl, H Loeschner, M Witt, W Pilz, ... Photomask Technology 2009 7488, 381-392, 2009 | 15 | 2009 |
Characterization of CMOS programmable multi-beam blanking arrays as used for programmable multi-beam projection lithography and resistless nanopatterning SE Kapl, H Loeschner, W Piller, M Witt, W Pilz, F Letzkus, M Jurisch, ... Journal of Micromechanics and Microengineering 21 (4), 045038, 2011 | 14 | 2011 |
Discussion in profile phenomena in sub-μm resist reactive ion etching W Pilz, H Hübner, F Heinrich, P Hoffmann, M Franosch Microelectronic Engineering 9 (1-4), 491-494, 1989 | 14 | 1989 |
Submicron patterns formed by reactive ion etching W Pilz, T Sponholz, S Pongratz, H Mader Microelectronic Engineering 3 (1-4), 467-473, 1985 | 13 | 1985 |
SIMS and AES investigations of contamination effects by RIE of PIQ layers IW Rangelow, K Maβeli, L Niewöhner, R Kassing, W Pilz Microelectronic Engineering 3 (1-4), 475-481, 1985 | 11 | 1985 |
Fabrication of relief-topographic surfaces with a one-step UV-lithographic process HJ Quenzer, W Henke, W Hoppe, W Pilz, K Reimer, B Wagner Microsystem technologies 1, 196-201, 1995 | 10 | 1995 |
Profile evolution in the multi-level technique W Pilz, J Pelka, P Banks Microelectronic engineering 11 (1-4), 521-525, 1990 | 7 | 1990 |
In-situ diagnostics for plasma processing P Banks, W Pilz, I Hussla, G Lorenz, G Castrischer Monitoring and Control of Plasma-Enhanced Processing of Semiconductors 1037 …, 1989 | 6 | 1989 |
How to etch the optimal silicon trench: Profile development and process discussion W Pilz, K Grändorff, J Janes, J Pelka Dry Etch Technology 1593, 178-185, 1992 | 1 | 1992 |