| Three-dimensional numerical and experimental investigations on polymer rheology in meso-scale injection molding CY Khor, ZM Ariff, FC Ani, MA Mujeebu, MK Abdullah, MZ Abdullah, ... International Communications in Heat and Mass Transfer 37 (2), 131-139, 2010 | 76 | 2010 |
| Computational fluid dynamic and thermal analysis for BGA assembly during forced convection reflow soldering process CS Lau, MZ Abdullah, F Che Ani Soldering & surface mount technology 24 (2), 77-91, 2012 | 58 | 2012 |
| CFD modeling of pin shape effects on capillary flow during wave soldering MSA Aziz, MZ Abdullah, CY Khor, A Jalar, FC Ani International Journal of Heat and Mass Transfer 72, 400-410, 2014 | 57 | 2014 |
| Influence of pin offset in PCB through-hole during wave soldering process: CFD modeling approach MSA Aziz, MZ Abdullah, CY Khor, FC Ani International Communications in Heat and Mass Transfer 48, 116-123, 2013 | 52 | 2013 |
| FVM based numerical study on the effect of solder bump arrangement on capillary driven flip chip underfill process CY Khor, MZ Abdullah, MA Mujeebu, FC Ani International Communications in Heat and Mass Transfer 37 (3), 281-286, 2010 | 52 | 2010 |
| Finite volume based CFD simulation of pressurized flip-chip underfill encapsulation process CY Khor, MA Mujeebu, MZ Abdullah, FC Ani Microelectronics Reliability 50 (1), 98-105, 2010 | 48 | 2010 |
| Hydrophobicity performance of polyethylene terephthalate (PET) and thermoplastic polyurethane (TPU) with thermal effect S Jasmee, G Omar, NAB Masripan, AA Kamarolzaman, AS Ashikin, ... Materials research express 5 (9), 096304, 2018 | 47 | 2018 |
| Numerical simulation of self-alignment of chip resistor components for different silver content during reflow soldering AM Najib, MZ Abdullah, AA Saad, Z Samsudin, FC Ani Microelectronics Reliability 79, 69-78, 2017 | 46 | 2017 |
| Hardness profiles of Sn-3.0 Ag-0.5 Cu-TiO2 composite solder by nanoindentation MZ Yahaya, FC Ani, Z Samsudin, S Sahin, MZ Abdullah, AA Mohamad Materials Science and Engineering: A 669, 178-186, 2016 | 46 | 2016 |
| Lattice Boltzmann method study of bga bump arrangements on void formation A Abas, MHH Ishak, MZ Abdullah, FC Ani, SF Khor Microelectronics Reliability 56, 170-181, 2016 | 45 | 2016 |
| Three‐dimensional thermal investigations at board level in a reflow oven using thermal‐coupling method CS Lau, MZ Abdullah, F Che Ani Soldering & Surface Mount Technology 24 (3), 167-182, 2012 | 43 | 2012 |
| Optimization modeling of the cooling stage of reflow soldering process for ball grid array package using the gray-based Taguchi method CS Lau, MZ Abdullah, FC Ani Microelectronics Reliability 52 (6), 1143-1152, 2012 | 41 | 2012 |
| Effect of ILU dispensing types for different solder bump arrangements on CUF encapsulation process A Abas, MS Haslinda, MHH Ishak, AS Nurfatin, MZ Abdullah, FC Ani Microelectronic Engineering 163, 83-97, 2016 | 40 | 2016 |
| Discrete phase method study of ball grid array underfill process using nano-silica filler-reinforced composite-encapsulant with varying filler loadings FC Ng, A Abas, ZL Gan, MZ Abdullah, FC Ani, MYT Ali Microelectronics Reliability 72, 45-64, 2017 | 38 | 2017 |
| SAC–xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly F Che Ani, A Jalar, AA Saad, CY Khor, R Ismail, Z Bachok, MA Abas, ... Soldering & Surface Mount Technology 30 (1), 1-13, 2018 | 36 | 2018 |
| Study on the fluid/structure interaction at different inlet pressures in molded packaging CY Khor, MZ Abdullah, FC Ani Microelectronic Engineering 88 (10), 3182-3194, 2011 | 35 | 2011 |
| Effect of solder joint arrangements on BGA lead-free reliability during cooling stage of reflow soldering process CS Lau, MZ Abdullah, FC Ani IEEE Transactions on Components, Packaging and Manufacturing Technology 2 …, 2012 | 27 | 2012 |
| Characterization of SAC–x NiO nano-reinforced lead-free solder joint in an ultra-fine package assembly F Che Ani, A Jalar, AA Saad, CY Khor, MA Abas, Z Bachok, NK Othman Soldering & Surface Mount Technology 31 (2), 109-124, 2019 | 25 | 2019 |
| The influence of Fe2O3 nano-reinforced SAC lead-free solder in the ultra-fine electronics assembly F Che Ani, A Jalar, AA Saad, CY Khor, R Ismail, Z Bachok, MA Abas, ... The International Journal of Advanced Manufacturing Technology 96, 717-733, 2018 | 21 | 2018 |
| Underfill process for two parallel plates and flip chip packaging CY Khor, MZ Abdullah, FC Ani International communications in heat and mass transfer 39 (8), 1205-1212, 2012 | 20 | 2012 |
Mohd Zulkfly AbdullahUniversiti Sains MalaysiaVerified email at eng.usm.my