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Co-authors
- Emanuel TutucProfessor, The University of Texas at AustinVerified email at mer.utexas.edu
- Kyounghwan KimAppleVerified email at utexas.edu
- Babak FallahazadIntel CorporationVerified email at intel.com
- Amritesh RaiFront End Process Integration Engineer @ Intel ▪️ UT Austin ▪️ Ohio StateVerified email at utexas.edu
- Stefano LarentisFA Engineer @ NXP SemiconductorsVerified email at utexas.edu
- Byung Gook ParkProfessor of Electrical Engineering, Seoul National UniversityVerified email at snu.ac.kr
- Kayoung LeeKAISTVerified email at kaist.ac.kr
- Amithraj ValsarajCore Compact Modeling, Intel CorporationVerified email at utexas.edu
- Anupam RoyThe University of Texas at AustinVerified email at austin.utexas.edu
- Hyungcheol ShinSeoul National University, Department of Electrical and Computer EngineeringVerified email at snu.ac.kr
- Samaresh GuchhaitHoward University, Washington, DCVerified email at Howard.edu
- Rudresh (Rudy) GhoshUniversity of Texas at AustinVerified email at rudyghosh.com
- Brian LeRoyUniversity of ArizonaVerified email at email.arizona.edu
- Shengqiang HuangUniversity of ArizonaVerified email at email.arizona.edu
- Matthew YankowitzUniversity of WashingtonVerified email at uw.edu
- Sushant SondeUT Austin, CNR-IMM, IMECVerified email at austin.utexas.edu
- Nitin PrasadIBM ResearchVerified email at ibm.com
- Jiwon ChangYonsei UniversityVerified email at yonsei.ac.kr
- Tanuj TrivediIntel CorpVerified email at utexas.edu
- Woo Young ChoiProfessor, Department of Electrical and Computer Engineering, Seoul National UniversityVerified email at snu.ac.kr