Method for maximizing air gap in back end of the line interconnect through via landing modification BD Briggs, LA Clevenger, CJ Penny, M Rizzolo US Patent 9,837,355, 2017 | 273 | 2017 |
Liquid-cooled electronics apparatus and methods of fabrication LA Campbell, RC Chu, MJ Ellsworth Jr, MK Iyengar, MR Rizzolo, ... US Patent 8,027,162, 2011 | 106 | 2011 |
A 14 nm Embedded STT-MRAM CMOS Technology D Edelstein, M Rizzolo, D Sil, A Dutta, J DeBrosse, M Wordeman, A Arceo, ... 2020 IEEE International Electron Devices Meeting (IEDM), 11.5. 1-11.5. 4, 2020 | 66 | 2020 |
Smartwatch blackbox BD Briggs, LA Clevenger, LAH Clevenger, IIJH Connell, NK Ratha, ... US Patent 9,758,095, 2017 | 38 | 2017 |
BEOL process integration for the 7 nm technology node T Standaert, G Beique, HC Chen, ST Chen, B Hamieh, J Lee, ... 2016 IEEE International Interconnect Technology Conference/Advanced …, 2016 | 36 | 2016 |
Emotional analysis and depiction in virtual reality BD Briggs, LA Clevenger, LAH Clevenger, CJ Penny, M Rizzolo, ... US Patent App. 15/445,335, 2018 | 19 | 2018 |
Low-temperature diffusion doping of copper interconnects independent of seed layer composition BD Briggs, LA Clevenger, CK Hu, T Nogami, D Priyadarshini, M RIZZOLO US Patent 10,192,829, 2019 | 17 | 2019 |
Low-temperature diffusion doping of copper interconnects independent of seed layer composition BD Briggs, LA Clevenger, CK Hu, T Nogami, D Priyadarshini, M Rizzolo US Patent 10,192,829, 2019 | 17 | 2019 |
Formation of embedded magnetic random-access memory devices A Dutta, CC Yang, JC Arnold, M Rizzolo, J Slaughter US Patent 10,707,413, 2020 | 16 | 2020 |
Bottom electrode for MRAM applications P Bhosale, RR Patlolla, M Rizzolo, CC Yang US Patent 10,096,769, 2018 | 16 | 2018 |
Social media modification of behavior and mobile screening for impairment BD Briggs, LA Clevenger, LAH Clevenger, IIJH Connell, NK Ratha, ... US Patent 10,045,096, 2018 | 16 | 2018 |
Real-Time Harm Prevention Through Feedback System With Automatic Detection of Human Behavioral and Emotional States BD Briggs, LA Clevenger, LAH Clevenger, IIJH Connell, NK Ratha, ... US Patent App. 14/945,179, 2017 | 16 | 2017 |
Airgap protection layer for via alignment BD Briggs, LA Clevenger, CJ Penny, M Rizzolo US Patent 9,553,019, 2017 | 15 | 2017 |
Modulating the microstructure of metallic interconnect structures RA Quon, M RIZZOLO, CC Yang US Patent 10,249,532, 2019 | 14* | 2019 |
Structure and method for BEOL nanoscale damascene sidewall-defined non-volatile memory element BD Briggs, LA Clevenger, M Rizzolo US Patent 9,559,107, 2017 | 14 | 2017 |
Enabling low resistance gates and contacts integrated with bilayer dielectrics R Bao, BD Briggs, LA Clevenger, K Motoyama, CB Peethala, M RIZZOLO, ... US Patent App. 10/204,828, 2019 | 13* | 2019 |
Fully aligned via with integrated air gaps BD Briggs, LA Clevenger, H Huang, CJ Penny, M Rizzolo, HK Shobha US Patent 9,966,337, 2018 | 13 | 2018 |
Fully aligned via employing selective metal deposition BD Briggs, JJ Kelly, DF Canaperi, M Rizzolo, LA Clevenger US Patent 10,395,986, 2019 | 12 | 2019 |
Method and system for targeted advertising based on natural language analytics M Ashoori, BD Briggs, LA Clevenger, LAH Clevenger, M Rizzolo US Patent App. 15/825,757, 2018 | 12 | 2018 |
Co-fabrication of magnetic device structures with electrical interconnects having reduced resistance through increased conductor grain size LA Clevenger, L Jiang, S Naczas, M Rizzolo, CC Yang US Patent 10,361,364, 2019 | 11 | 2019 |