| Wafer‐Scale and Low‐Temperature Growth of 1T‐WS2 Film for Efficient and Stable Hydrogen Evolution Reaction HU Kim, V Kanade, M Kim, KS Kim, BS An, H Seok, H Yoo, LE Chaney, ... Small 16 (6), 1905000, 2020 | 86 | 2020 |
| Kirkendall effect induced bifunctional hybrid electrocatalyst (Co9S8@ MoS2/N-doped hollow carbon) for high performance overall water splitting M Kim, H Seok, NCS Selvam, J Cho, GH Choi, MG Nam, S Kang, T Kim, ... Journal of Power Sources 493, 229688, 2021 | 79 | 2021 |
| Low-Temperature Synthesis of Wafer-Scale MoS2–WS2 Vertical Heterostructures by Single-Step Penetrative Plasma Sulfurization H Seok, YT Megra, CK Kanade, J Cho, VK Kanade, M Kim, I Lee, PJ Yoo, ... ACS Nano, 2021 | 55 | 2021 |
| Effects of trivalent lanthanide (La and Nd) doped ceria abrasives on chemical mechanical polishing E Kim, J Lee, C Bae, H Seok, HU Kim, T Kim Powder Technology 397, 117025, 2022 | 49 | 2022 |
| Flexible MoS₂–Polyimide Electrode for Electrochemical Biosensors and Their Applications for the Highly Sensitive Quantification of Endocrine Hormones: PTH, T3, and T4 HU Kim, HY Kim, H Seok, V Kanade, H Yoo, KY Park, JH Lee, MH Lee, ... Analytical Chemistry 92 (9), 6327-6333, 2020 | 49 | 2020 |
| Low-temperature and large-scale production of a transition metal sulfide vertical heterostructure and its application for photodetectors CK Kanade, H Seok, VK Kanade, K Aydin, HU Kim, SB Mitta, WJ Yoo, ... ACS Applied Materials & Interfaces 13 (7), 8710-8717, 2021 | 43 | 2021 |
| Patchwork-Structured Heterointerface of 1T-WS2/a-WO3 with Sustained Hydrogen Spillover as a Highly Efficient Hydrogen Evolution Reaction Electrocatalyst J Cho, M Kim, H Seok, GH Choi, SS Yoo, NC Sagaya Selvam, PJ Yoo, ... ACS Applied Materials & Interfaces 14 (20), 24008-24019, 2022 | 40 | 2022 |
| Improvement of oxide removal rate in chemical mechanical polishing by forming oxygen vacancy in ceria abrasives via ultraviolet irradiation E Kim, J Hong, S Hong, C Kanade, H Seok, HU Kim, T Kim Materials Chemistry and Physics 273, 124967, 2021 | 38 | 2021 |
| Improvement of oxide chemical mechanical polishing performance by increasing Ce3+/Ce4+ ratio in ceria slurry via hydrogen reduction J Lee, E Kim, C Bae, H Seok, J Cho, K Aydin, T Kim Materials Science in Semiconductor Processing 159, 107349, 2023 | 30 | 2023 |
| Concurrent and Selective Determination of Dopamine and Serotonin with Flexible WS2/Graphene/Polyimide Electrode Using Cold Plasma HU Kim, A Koyappayil, H Seok, K Aydin, C Kim, KY Park, N Jeon, ... Small 17 (45), 2102757, 2021 | 30 | 2021 |
| Realization of Wafer‐Scale 1T‐MoS2 Film for Efficient Hydrogen Evolution Reaction HU Kim, M Kim, H Seok, KY Park, JY Moon, J Park, BS An, HJ Jung, ... ChemSusChem, 2021 | 30 | 2021 |
| Block copolymer-directed facile synthesis of N-doped mesoporous graphitic carbon for reliable, high-performance Zn ion hybrid supercapacitor KW Kim, B Park, J Kim, H Seok, T Kim, C Jo, JK Kim ACS Applied Materials & Interfaces 15 (50), 57905-57912, 2023 | 27 | 2023 |
| Tailoring Polymorphic Heterostructures of MoS2–WS2 (1T/1T, 2H/2H) for Efficient Hydrogen Evolution Reaction H Seok, M Kim, J Cho, E Kim, S Son, KW Kim, JK Kim, PJ Yoo, M Kim, ... ACS Sustainable Chemistry & Engineering 11 (2), 568-577, 2023 | 22 | 2023 |
| Investigation of abrasive-free slurry for polysilicon buffing chemical mechanical planarization S Jeon, J Hong, S Hong, C Kanade, K Park, H Seok, H Kim, S Lee, T Kim Materials Science in Semiconductor Processing 128, 105755, 2021 | 15 | 2021 |
| Synapse-mimetic hardware-implemented resistive random-access memory for artificial neural network H Seok, S Son, SB Jathar, J Lee, T Kim Sensors 23 (6), 3118, 2023 | 14 | 2023 |
| Soft template-assisted fabrication of mesoporous graphenes for high-performance energy storage systems KW Kim, J Kim, C Choi, HK Yoon, MC Go, J Lee, JK Kim, H Seok, T Kim, ... ACS applied materials & interfaces 14 (41), 46994-47002, 2022 | 13 | 2022 |
| The first progress of plasma-based transition metal dichalcogenide synthesis: a stable 1T phase and promising applications HU Kim, H Seok, WS Kang, T Kim Nanoscale Advances 4 (14), 2962-2972, 2022 | 11 | 2022 |
| Beyond von Neumann Architecture: Brain‐Inspired Artificial Neuromorphic Devices and Integrated Computing H Seok, D Lee, S Son, H Choi, G Kim, T Kim Advanced Electronic Materials, 2300839, 2024 | 10 | 2024 |
| Chromism-Integrated Sensors and Devices for Visual Indicators H Seok, S Son, J Cho, S Choi, K Park, C Kim, N Jeon, T Kim, HU Kim Sensors 22 (11), 4288, 2022 | 10 | 2022 |
| Communication—effect of hydrogen water on ceria abrasive removal in post-CMP cleaning S Hong, SH Park, C Kanade, J Lee, P Liu, I Lee, H Seok, T Kim ECS Journal of Solid State Science and Technology 9 (4), 044012, 2020 | 10 | 2020 |
Taesung KimSungkyunkwan UniversityVerified email at skku.edu