A review of silicon-based wafer bonding processes, an approach to realize the monolithic integration of Si-CMOS and III–V-on-Si wafers S Bao, Y Wang, K Lina, L Zhang, B Wang, WA Sasangka, KEK Lee, ... Journal of Semiconductors 42 (2), 023106, 2021 | 63 | 2021 |
Reduction of threading dislocation density in Ge/Si using a heavily As-doped Ge seed layer CST Kwang Hong Lee, Shuyu Bao, Bing Wang, Cong Wang, Soon Fatt Yoon, Jurgen ... AIP Advances 6, 025028, 2016 | 63 | 2016 |
Extraordinary infrared photoluminescence efficiency of Er0. 1Yb1. 9SiO5 films on SiO2/Si substrates XJ Wang, B Wang, L Wang, RM Guo, H Isshiki, T Kimura, Z Zhou Applied Physics Letters 98 (7), 2011 | 55 | 2011 |
Optical amplification in Er/Yb silicate slot waveguide R Guo, B Wang, X Wang, L Wang, L Jiang, Z Zhou Optics letters 37 (9), 1427-1429, 2012 | 53 | 2012 |
GeSn-on-insulator substrate formed by direct wafer bonding YCY Dian Lei, Kwang Hong Lee, Shuyu Bao, Wei Wang, Bing Wang, Xiao Gong ... Applied Physics Letters 109 (2), 022106, 2016 | 45 | 2016 |
Optical amplification in Er/Yb silicate strip loaded waveguide R Guo, X Wang, K Zang, B Wang, L Wang, L Gao, Z Zhou Applied Physics Letters 99 (16), 2011 | 45 | 2011 |
HybridSilicate Waveguides for Amplifier Application L Wang, R Guo, B Wang, X Wang, Z Zhou IEEE Photonics Technology Letters 24 (11), 900-902, 2012 | 32 | 2012 |
Monolithic integration of Si-CMOS and III-V-on-Si through direct wafer bonding process KH Lee, Y Wang, B Wang, L Zhang, WA Sasangka, SC Goh, S Bao, ... IEEE Journal of the Electron Devices Society 6, 571-578, 2017 | 28 | 2017 |
Efficient grating couplers for space division multiplexing applications M Zhang, H Liu, B Wang, G Li, L Zhang IEEE Journal of Selected Topics in Quantum Electronics 24 (6), 1-5, 2018 | 17 | 2018 |
On-chip optical interconnects using ingan light-emitting diodes integrated with si-cmos B Wang, L Zhang, W Zhang, C Wang, KEK Lee, J Michel, SJ Chua, ... Asia Communications and Photonics Conference, AW4A. 2, 2014 | 17 | 2014 |
Design of an erbium-doped Al2O3 optical waveguide amplifier with on-chip integrated laser pumping source P Xiao, B Wang Optics Communications 508, 127709, 2022 | 16 | 2022 |
Ultralow-power LED-enabled on-chip optical communication designed in the III-nitride and silicon CMOS process integrated platform W Zhang, L Zhang, B Wang, Z Zhu, KEK Lee, J Michel, C Soo-Jin, LS Peh IEEE Design & Test 31 (5), 36-45, 2014 | 14 | 2014 |
High-performance AlGaInP light-emitting diodes integrated on silicon through a superior quality germanium-on-insulator Y Wang, B Wang, WA Sasangka, S Bao, Y Zhang, HV Demir, J Michel, ... Photonics Research 6 (4), 290-295, 2018 | 13 | 2018 |
Method of forming an integrated circuit and related integrated circuit W Zhang, B Wang, L Zhang, Z Zhu, J Michel, SJ Chua, LS Peh, SB Chiah, ... US Patent 9,874,689, 2018 | 13 | 2018 |
Near-infrared electroluminescence in ErYb silicate based light-emitting device B Wang, RM Guo, XJ Wang, L Wang, LY Hong, B Yin, LF Gao, Z Zhou Optical Materials 34 (8), 1371-1374, 2012 | 13 | 2012 |
Effectiveness of InGaAs/GaAs superlattice dislocation filter layers epitaxially grown on 200 mm Si wafers with and without Ge buffers B Wang, GJ Syaranamual, KH Lee, S Bao, Y Wang, KEK Lee, ... Semiconductor Science and Technology 35 (9), 095036, 2020 | 12 | 2020 |
Design of an on-chip electrically driven, position-adapted, fully integrated erbium-based waveguide amplifier for silicon photonics P Zhou, B Wang, X Wang, B Wang, Y He, JE Bowers OSA Continuum 4 (3), 790-814, 2021 | 10 | 2021 |
Large electroluminescence excitation cross section and strong potential gain of erbium in ErYb silicate B Wang, R Guo, X Wang, L Wang, B Yin, Z Zhou Journal of Applied Physics 113 (10), 2013 | 10 | 2013 |
Direct bandgap photoluminescence from n-type indirect GaInP alloys C Wang, B Wang, RI Made, SF Yoon, J Michel Photonics Research 5 (3), 239-244, 2017 | 9 | 2017 |
Epitaxy and characterization of GaInP/AlInP light-emitting diodes on As-doped Ge/Si substrates C Wang, B Wang, KH Lee, CS Tan, SF Yoon, J Michel Optics express 24 (20), 23129-23135, 2016 | 9 | 2016 |