| Adhesion and collapse of extreme ultraviolet photoresists and the role of underlayers R Fallica, S Chen, D De Simone, HS Suh Journal of Micro/Nanopatterning, Materials, and Metrology 21 (3), 034601-034601, 2022 | 16 | 2022 |
| Scaling and readiness of underlayers for high-NA EUV lithography R Fallica, D De Simone, S Chen, M Safdar, HS Suh International Conference on Extreme Ultraviolet Lithography 2022 12292, 244-251, 2022 | 9 | 2022 |
| Patterning optimization for single mask bit-line-periphery and storage-node-landing-pad DRAM layers using 0.33 NA EUV lithography at the resolution limit J Lee, K Sah, YL Chen, S Heo, S Hwang, K Miyaguchi, B Dey, ... Advances in Patterning Materials and Processes XLI 12957, 145-155, 2024 | 2 | 2024 |
| Exploring Machine Learning for Semiconductor Process Optimization: A Systematic Review YL Chen, S Sacchi, B Dey, V Blanco, S Halder, P Leray, S De Gendt IEEE Transactions on Artificial Intelligence, 2024 | 1 | 2024 |
| Towards improved semiconductor defect inspection for high-NA EUVL based on SEMI-SuperYOLO-NAS YL Chen, J Deforce, V De Ridder, B Dey, V Blanco, S Halder, P Leray Metrology, Inspection, and Process Control XXXVIII 12955, 197-215, 2024 | 1 | 2024 |
