| Defect distribution and microstructure heterogeneity effects on fracture resistance and fatigue behavior of EBM Ti–6Al–4V M Seifi, A Salem, D Satko, J Shaffer, JJ Lewandowski International Journal of Fatigue 94, 263-287, 2017 | 274 | 2017 |
| Building texture evolution networks for deformation processing of polycrystalline fcc metals using spectral approaches: Applications to process design for targeted performance JB Shaffer, M Knezevic, SR Kalidindi International Journal of Plasticity 26 (8), 1183-1194, 2010 | 107 | 2010 |
| Determination of an effective zero-point and extraction of indentation stress–strain curves without the continuous stiffness measurement signal S Pathak, J Shaffer, SR Kalidindi Scripta Materialia 60 (6), 439-442, 2009 | 92 | 2009 |
| Benchmarking CAD search techniques D Bespalov, CY Ip, WC Regli, J Shaffer Proceedings of the 2005 ACM symposium on Solid and physical modeling, 275-286, 2005 | 85 | 2005 |
| Effect of microstructure on oxygen rich layer evolution and its impact on fatigue life during high-temperature application of α/β titanium DP Satko, JB Shaffer, JS Tiley, SL Semiatin, AL Pilchak, SR Kalidindi, ... Acta Materialia 107, 377-389, 2016 | 81 | 2016 |
| Representation of the orientation distribution function and computation of first-order elastic properties closures using discrete Fourier transforms SR Kalidindi, M Knezevic, S Niezgoda, J Shaffer Acta Materialia 57 (13), 3916-3923, 2009 | 73 | 2009 |
| Workflow for integrating mesoscale heterogeneities in materials structure with process simulation of titanium alloys AA Salem, JB Shaffer, DP Satko, SL Semiatin, SR Kalidindi Integrating Materials and Manufacturing Innovation 3, 322-343, 2014 | 29 | 2014 |
| Microstructure-informed cloud computing for interoperability of materials databases and computational models: microtextured regions in Ti alloys AA Salem, JB Shaffer, RA Kublik, LA Wuertemberger, DP Satko Integrating Materials and Manufacturing Innovation 6 (1), 111-126, 2017 | 21 | 2017 |
| Wireless Internet Collaboration System on Smartphones. N Belov, I Braude, W Krandick, J Shaffer CAiSE Workshops (2), 675-689, 2005 | 14 | 2005 |
| The effect of lath orientations on oxygen ingress in titanium alloys J Tiley, J Shaffer, A Shiveley, A Pilchak, A Salem Metallurgical and Materials Transactions A 45, 1041-1048, 2014 | 12 | 2014 |
| Identification and quantification of microtextured regions in materials with ordered crystal structure AA Salem, JB Shaffer US Patent 9,070,203, 2015 | 10 | 2015 |
| CAD archives based on OAIS JB Kopena, J Shaffer, WC Regli International Design Engineering Technical Conferences and Computers and …, 2006 | 10 | 2006 |
| Adaptive data collection for local states of a material AA Salem, DP Satko, JB Shaffer US Patent 9,557,299, 2017 | 9 | 2017 |
| Detection of the integrity of additively manufactured parts AA Salem, DP Satko, JB Shaffer US Patent 10,268,182, 2019 | 7 | 2019 |
| Web Service Interfaces for Design Repositories J Shaffer, JB Kopena, WC Regli International Design Engineering Technical Conferences and Computers and …, 2005 | 6 | 2005 |
| Quantifying Ti-6 Al-4 V bimodal microstructure using microstructure informatics A Salem, D Turner, D Satko, J Shaffer, S Niezgoda, S Kalidindi AIP Conference Proceedings, 2012 | 4 | 2012 |
| Demonstration of the secure wireless agent testbed (swat) G Anderson, A Burnheimer, V Cicirello, D Dorsey, S Garcia, M Kam, ... The 14th International Conference on Automated Planning and Scheduling, 2004 | 3 | 2004 |
| Mixed-initiative approach to collaboration in the mathematical domain N Belov, J Shaffer PROCEEDINGS OF THE NATIONAL CONFERENCE ON ARTIFICIAL INTELLIGENCE 20 (4), 1590, 2005 | 2 | 2005 |
| Non-intrusive stochastic modeling to account for microstructure variability SR Niezgoda, M Yuan, N Galbincea, A Salem, J Shaffer 19th AIAA Non-Deterministic Approaches Conference, 0816, 2017 | 1 | 2017 |
| Mobile mathematics communication N Belov, C Koeck, W Krandick, J Shaffer ACM SIGSAM Bulletin 39 (3), 99-99, 2005 | 1 | 2005 |
Ayman A. SalemCEO, Materials Resources LLCVerified email at ICMRL.net