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Co-authors
Julia GreerCalifornia Institute of TechnologyVerified email at caltech.edu
Satyajit DasCambridge University, Caltech, IIT Kharagpur, Ecole PolytechniqueVerified email at cam.ac.uk
Lauren MontemayorMicrodevices Engineer, NASA Jet Propulsion LaboratoryVerified email at jpl.nasa.gov
Dennis KochmannETH ZurichVerified email at ethz.ch
Ruth SchwaigerForschungszentrum Juelich GmbHVerified email at fz-juelich.de
Arturo J MateosMechanical & Aerospace EngineeringVerified email at caltech.edu
Nigel ClarkeStaff Research Engineer @ Samsung's Think Tank TeamVerified email at samsung.com
Dongchan JangKorea Advanced Institute of Science and Technology (KAIST)Verified email at kaist.ac.kr
Lorenzo ValdevitUniversity of California, IrvineVerified email at uci.edu
Tobias A. SchaedlerDepartment Manager and Senior Scientist, HRL Laboratories, LLCVerified email at hrl.com
Xiaoyu (Rayne) ZhengUniversity of California, BerkeleyVerified email at berkeley.edu
Robert MaassFederal Institute of Materials Research and Testing & University of Illinois at Urbana-ChampaignVerified email at bam.de
Carlos M. PortelaMassachusetts Institute of TechnologyVerified email at mit.edu