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Co-authors
Jean Anne (Currivan) Incorvia, Ph.D.University of Texas at AustinVerified email at austin.utexas.edu
Marc BaldoMIT, Dept of Electrical Engineering and Computer ScienceVerified email at mit.edu
Pin HoScientist, A*STAR, Institute of Materials Research and EngineeringVerified email at imre.a-star.edu.sg
Kun-Hua TuMassachusetts Institute of TechnologyVerified email at MIT.EDU
Larysa Tryputen, Ph.D.QuTech and Netherlands Organization for Applied Scientific Research (TNO), Delft, The NetherlandsVerified email at tno.nl
Enno Lagetk MSVerified email at thyssenkrupp.com
Wubin BaiUniversity of North Carolina - Chapel HillVerified email at unc.edu
Ronghua Liu,Professor, Nanjing UniversityVerified email at nju.edu.cn
Saima SiddiquiPostdoctoral Associate, University of Illinois, Urbana-Champaign; Ph.D., MIT
Seonghoon WooAmogy, IBM, KIST, MITVerified email at amogy.co
Saman SafariMassachusetts Institute of Technology (MIT)Verified email at mit.edu