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Boon S. OoiKing Abdullah University of Science & Technology (KAUST)Verified email at kaust.edu.sa
Hassan Makine OubeiKing Abdullah University of Science and TechnologyVerified email at kaust.edu.sa
Xiaobin SunSenior Engineer, HuaweiVerified email at huawei.com
Bilal JanjuaUofTVerified email at utoronto.ca
Chun Hong KangKing Abdullah University of Science and Technology (KAUST)Verified email at kaust.edu.sa
Prof. Mohamed-Slim AlouiniWireless CT Lab, King Abdullah University of Science and Technology (KAUST), Kingdom of Saudi ArabiaVerified email at kaust.edu.sa
Changmin LeeKYOCERA SLD LaserVerified email at umail.ucsb.edu
Chao ZhaoProfessor, Institute of Semiconductors, Chinese Academy of Sciences; Fellow of IOPVerified email at semi.ac.cn
Jorge A. Holguín-LermaCorning IncorporatedVerified email at corning.com
Kang-Ting HoKAUSTVerified email at kaust.edu.sa
Omar AlkhazragiUniversity of MichiganVerified email at umich.edu
Guangyu LiuKAUST, Intel, Lehigh UniversityVerified email at kaust.edu.sa
Aditya PrabaswaraEpitaxy development engineer, ams OSRAM international GmbHVerified email at tyndall.ie
Osman BakrProfessor, Materials Science & Eng., King Abdullah University of Science and Technology (KAUST)Verified email at kaust.edu.sa
John T. LeonardAppleVerified email at umail.ucsb.edu
Abdullah AlatawiKing Abdullah University for Science and TechnologyVerified email at kaust.edu.sa
Jun PanZhejiang University of Technology; KAUSTVerified email at zjut.edu.cn
Mohammed Zahed M. KhanSenior Lecturer, Electrical and Electronics Engg, School of EBE, Anglia Ruskin UniversityVerified email at aru.ac.uk
Jr-Hau HeProfessor of Materials Science & Engineering, City University of Hong KongVerified email at cityu.edu.hk
Omar F. Mohammed, PhD, FRSC, FIM...Professor, Materials Science & Engineering, King Abdullah University of Science and TechnologyVerified email at kaust.edu.sa