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Weida Hu (胡伟达)Shanghai Institute of Technical Physics, CASVerified email at mail.sitp.ac.cn
Jianlu WangFudan UniversityVerified email at fudan.edu.cn
Zhen WangShanghai Institute of Technical Physics, Chinese Academy of SciencesVerified email at mail.sitp.ac.cn
Hehai FangShanghai Institute of Technical PhysicsVerified email at mail.nankai.edu.cn
Qing LiHangzhou Institute for Advanced StudyVerified email at ucas.ac.cn
Zhou PengFudan UniversityVerified email at fudan.edu.cn
Nan Guo(郭楠)Qian Xuesen Laboratory of Space Technology, China Academy of Space TechnologyVerified email at qxslab.cn
Feng WuHuazhong University of Science and TechnologyVerified email at hust.edu.cn
Jian-Bin XU 许建斌Chinese University of Hong Kong (CUHK); Shenzhen Institutes of Advanced Technology (SIAT), CASVerified email at ee.cuhk.edu.hk
Faxian XiuPhysics Department, Fudan UniversityVerified email at fudan.edu.cn
Johnny C. HoAssociate VP (Enterprise) and Professor, Materials Science and Engin., City University of Hong KongVerified email at cityu.edu.hk
Zhiyong FanProfessor of Electronic and Computer Engineering, Hong Kong University of Science andVerified email at ust.hk
Feng MiaoProfessor of Physics, Nanjing UniversityVerified email at nju.edu.cn
Guozhen Shen/沈国震Beijing Institute of TechnologyVerified email at bit.edu.cn
Xiang Yuan (袁翔)East China Normal UniversityVerified email at lps.ecnu.edu.cn