| Interfacial charge redistribution in interconnected network of Ni2P–Co2P boosting electrocatalytic hydrogen evolution in both acidic and alkaline conditions Q Cao, S Hao, Y Wu, K Pei, W You, R Che Chemical Engineering Journal 424, 130444, 2021 | 97 | 2021 |
| Lotus leaf-like dual-scale silver film applied as a superhydrophobic and self-cleaning substrate Y Wu, T Hang, Z Yu, L Xu, M Li Chemical Communications 50 (61), 8405-8407, 2014 | 67 | 2014 |
| On-site chemical pre-lithiation of S cathode at room temperature on a 3D nano-structured current collector Y Wu, T Momma, S Ahn, T Yokoshima, H Nara, T Osaka Journal of Power Sources 366, 65-71, 2017 | 60 | 2017 |
| High-adhesive superhydrophobic 3D nanostructured silver films applied as sensitive, long-lived, reproducible and recyclable SERS substrates Y Wu, T Hang, J Komadina, H Ling, M Li Nanoscale 6 (16), 9720-9726, 2014 | 52 | 2014 |
| Effects of 2-mercaptopyridine and Janus Green B as levelers on electrical resistance of electrodeposited copper thin film for interconnects Y Zhang, T Hang, M Dong, Y Wu, H Ling, A Hu, M Li Thin Solid Films 677, 39-44, 2019 | 44 | 2019 |
| Growth behavior and formation mechanism of porous Cu3Sn in Cu/Sn solder system K Lin, H Ling, A Hu, Y Wu, L Gao, T Hang, M Li Materials Characterization 178, 111271, 2021 | 41 | 2021 |
| A pre-lithiation method for sulfur cathode used for future lithium metal free full battery Y Wu, T Yokoshima, H Nara, T Momma, T Osaka Journal of Power Sources 342, 537-545, 2017 | 35 | 2017 |
| Film properties of electropolymerized polypyrrole for a sulfur/ketjenblack cathode in lithium secondary batteries N Nakamura, Y Wu, T Yokoshima, H Nara, T Momma, T Osaka Journal of The Electrochemical Society 163 (5), A683, 2016 | 33 | 2016 |
| Bioinspired multifunctional Au nanostructures with switchable adhesion X Mo, Y Wu, J Zhang, T Hang, M Li Langmuir 31 (39), 10850-10858, 2015 | 31 | 2015 |
| Electrodeposition of high density silver nanosheets with controllable morphologies served as effective and reproducible SERS substrates Y Xia, Y Wu, T Hang, J Chang, M Li Langmuir 32 (14), 3385-3392, 2016 | 28 | 2016 |
| Wetting transition of the caterpillar-like superhydrophobic Cu/Ni–Co hierarchical structure by heat treatment N Wang, Y Yuan, Y Wu, T Hang, M Li Langmuir 31 (39), 10807-10812, 2015 | 28 | 2015 |
| Applicable superamphiphobic Ni/Cu surface with high liquid repellency enabled by the electrochemical-deposited dual-scale structure T Wang, J Cai, Y Wu, T Hang, A Hu, H Ling, M Li ACS applied materials & interfaces 11 (12), 11106-11111, 2019 | 23 | 2019 |
| Competitive effect of leveler's electrochemical behavior and impurity on electrical resistance of electroplated copper Z Zhang, Y Wu, Y Zhang, T Hang, A Hu, H Ling, M Li Journal of the Electrochemical Society 166 (13), D577, 2019 | 22 | 2019 |
| Nonvolatile resistive memory and synaptic learning using hybrid flexible memristor based on combustion synthesized Mn-ZnO Q Xue, T Hang, J Liang, CC Chen, Y Wu, H Ling, M Li Journal of Materials Science & Technology 119, 123-130, 2022 | 21 | 2022 |
| Mechanism on preferred orientation roof-type Cu6Sn5 grain formation in micro-bump with (111) nanotwinned copper UBM Y Wu, ML Huang, SN Zhang Materials Characterization 179, 111316, 2021 | 20 | 2021 |
| CuO Nanofilm-Covered Cu Microcone Coating for a Long Cycle Li Metal Anode by In Situ Formed Li2O W Hu, Y Yao, X Huang, S Ju, Z Chen, M Li, Y Wu ACS Applied Energy Materials 5 (3), 3773-3782, 2022 | 19 | 2022 |
| Highly durable non-sticky silver film with a microball-nanosheet hierarchical structure prepared by chemical deposition Y Wu, T Hang, N Wang, Z Yu, M Li Chemical Communications 49 (88), 10391-10393, 2013 | 19 | 2013 |
| Anomalous growth of interfacial intermetallic compounds on (111)-oriented nanotwinned Cu substrate Y Wu, ML Huang Journal of Alloys and Compounds 858, 158340, 2021 | 16 | 2021 |
| Synthesis and characterization of multilayer core–shell structure hollow spheres with low density, favorable magnetic and conductive properties X Xie, Y Wu, Y Kong, Z Zhang, X Zhou Colloids and Surfaces A: Physicochemical and Engineering Aspects 408, 104-113, 2012 | 16 | 2012 |
| Growth mechanism of interfacial IMCs on (111) preferred orientation nanotwinned Cu UBM for 3D IC packaging ML Huang, Y Wu 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1881-1887, 2020 | 13 | 2020 |
Tao HANG 杭弢Shanghai Jiao Tong UniversityVerified email at sjtu.edu.cn