Articles with public access mandates - Yunwen WULearn more
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Interfacial charge redistribution in interconnected network of Ni2P–Co2P boosting electrocatalytic hydrogen evolution in both acidic and alkaline conditions
Q Cao, S Hao, Y Wu, K Pei, W You, R Che
Chemical Engineering Journal 424, 130444, 2021
Mandates: National Natural Science Foundation of China
High-adhesive superhydrophobic 3D nanostructured silver films applied as sensitive, long-lived, reproducible and recyclable SERS substrates
Y Wu, T Hang, J Komadina, H Ling, M Li
Nanoscale 6 (16), 9720-9726, 2014
Mandates: National Natural Science Foundation of China
Growth behavior and formation mechanism of porous Cu3Sn in Cu/Sn solder system
K Lin, H Ling, A Hu, Y Wu, L Gao, T Hang, M Li
Materials Characterization 178, 111271, 2021
Mandates: National Natural Science Foundation of China
Bioinspired multifunctional Au nanostructures with switchable adhesion
X Mo, Y Wu, J Zhang, T Hang, M Li
Langmuir 31 (39), 10850-10858, 2015
Mandates: National Natural Science Foundation of China
Electrodeposition of high density silver nanosheets with controllable morphologies served as effective and reproducible SERS substrates
Y Xia, Y Wu, T Hang, J Chang, M Li
Langmuir 32 (14), 3385-3392, 2016
Mandates: National Natural Science Foundation of China
Wetting transition of the caterpillar-like superhydrophobic Cu/Ni–Co hierarchical structure by heat treatment
N Wang, Y Yuan, Y Wu, T Hang, M Li
Langmuir 31 (39), 10807-10812, 2015
Mandates: National Natural Science Foundation of China
Applicable superamphiphobic Ni/Cu surface with high liquid repellency enabled by the electrochemical-deposited dual-scale structure
T Wang, J Cai, Y Wu, T Hang, A Hu, H Ling, M Li
ACS applied materials & interfaces 11 (12), 11106-11111, 2019
Mandates: National Natural Science Foundation of China
Competitive effect of leveler's electrochemical behavior and impurity on electrical resistance of electroplated copper
Z Zhang, Y Wu, Y Zhang, T Hang, A Hu, H Ling, M Li
Journal of the Electrochemical Society 166 (13), D577, 2019
Mandates: National Natural Science Foundation of China
Nonvolatile resistive memory and synaptic learning using hybrid flexible memristor based on combustion synthesized Mn-ZnO
Q Xue, T Hang, J Liang, CC Chen, Y Wu, H Ling, M Li
Journal of Materials Science & Technology 119, 123-130, 2022
Mandates: National Natural Science Foundation of China
Mechanism on preferred orientation roof-type Cu6Sn5 grain formation in micro-bump with (111) nanotwinned copper UBM
Y Wu, ML Huang, SN Zhang
Materials Characterization 179, 111316, 2021
Mandates: National Natural Science Foundation of China
CuO Nanofilm-Covered Cu Microcone Coating for a Long Cycle Li Metal Anode by In Situ Formed Li2O
W Hu, Y Yao, X Huang, S Ju, Z Chen, M Li, Y Wu
ACS Applied Energy Materials 5 (3), 3773-3782, 2022
Mandates: National Natural Science Foundation of China
Anomalous growth of interfacial intermetallic compounds on (111)-oriented nanotwinned Cu substrate
Y Wu, ML Huang
Journal of Alloys and Compounds 858, 158340, 2021
Mandates: National Natural Science Foundation of China
Growth mechanism of interfacial IMCs on (111) preferred orientation nanotwinned Cu UBM for 3D IC packaging
ML Huang, Y Wu
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1881-1887, 2020
Mandates: National Natural Science Foundation of China
Robust CuO micro-cone decorated membrane with superhydrophilicity applied for oil–water separation and anti-viscous-oil fouling
J Zhang, S Wang, Y Wu, B Fu, Q Cao, T Hang, A Hu, H Ling, M Li
Materials Characterization 179, 111387, 2021
Mandates: National Natural Science Foundation of China
Thermal oxidation fabricated copper oxide nanotip arrays with tunable wettability and robust stability: implications for microfluidic devices and oil/water separation
Y Wu, S Wang, S Ju, Z Zhou, T Wang, T Hang, M Li
ACS Applied Nano Materials 4 (5), 4713-4720, 2021
Mandates: National Natural Science Foundation of China
Redeposition mechanism on silicon oxide layers during selective etching process in 3D NAND manufacture
Z Zhou, Y Wu, H Ling, J Guo, S Wang, M Li
Journal of Industrial and Engineering Chemistry 119, 218-225, 2023
Mandates: National Natural Science Foundation of China
Low-temperature insertion bonding using electroless Cu-Co-P micro-cones array with controllable morphology
Y Sun, J Wang, X Zhang, C Yang, A Hu, T Hang, Y Wu, H Ling, M Li
Electronic Materials Letters 17 (6), 459-470, 2021
Mandates: National Natural Science Foundation of China
The evolution of microstructure and resistance in electroplated copper films by linear integrated laser scanning annealing
L Tan, S Han, S Chen, T Hang, H Ling, Y Wu, M Li
Electronic Materials Letters 17, 207-214, 2021
Mandates: National Natural Science Foundation of China
Covalent grafting of dielectric films on Cu (111) surface via electrochemical reduction of aryl diazonium salts
L Cao, Y Wu, T Hang, M Li
Langmuir 38 (48), 14969-14980, 2022
Mandates: National Natural Science Foundation of China
Application of electrodeposited Cu-metal nanoflake structures as 3D current collector in lithium-metal batteries
Y Xia, W Hu, Y Yao, S Chen, S Ahn, T Hang, Y Wu, M Li
Nanotechnology 33 (24), 245406, 2022
Mandates: National Natural Science Foundation of China
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